Meeting Details

ICEPT2023

August 8~11, 2023,Xinjiang,China

1st Call for Papers

2023 24th International Conference on Electronic Packaging Technology (ICEPT) will be held in Xinjiang, China, from August 8 to 11, 2023. The conference was hosted by Institute of microelectronics, Chinese Academy of Sciences, IEEE-EPS and CIE-EMPT, organized by Shihezi University of and co organized by The National Center for Advanced Packaging (NCAP China) and Beijing HRZX Consulting Co., it has become one of the four major brand conferences in the field of international electronic packaging. At present, Moore's Law has reached an inflection point, semiconductor manufacturing technology is facing challenges, and new packaging technologies are constantly emerging. The conference will provide an academic communication platform for experts, scholars and researchers worldwide on new progress and new ideas of electronic packaging and manufacturing technology.

During the four-day event, participants from many countries and region will share the latest technological developments of electronic packaging technologies via special lectures, invited talks, theme forums, technical sessions, exhibitions, poster presentations and other forms. We sincerely invite you to join in this event!


CONFERENCE TOPICS

Advanced Packaging: 2.5D and 3D packaging, wafer-level and panel-level packaging, flip chip, Fan-Out, system integration, heterogeneous/hybrid integration.

 Packaging Materials & Processes: New packaging materials, advanced packaging substrate, green materials, nano-materials, and related packaging materials for packaging/assembly processes.

 Packaging Design & Modeling: Design, modeling, methodology, and simulation for system integration and packaging; methodology and simulation for electrical/thermal/optical/mechanical models, multi-scale and multi-physics modeling, process simulation.

 Interconnection Technologies: TSV, bumping and micro copper pillar technologies, high density inter-connection technologies, Hybrid bonding technologies, nano-materials bonding technologies, interposer, redistribution layer technologies for fan-in and fan-out packaging, chip-to-wafer/panel and wafer-to-wafer interconnect technologies, thermocompression bonding, non-conventional inter-connection technologies.

 Advanced Manufacturing: Assembly, testing, manufacturing, automation technologies and equipment for Packaging manufacturing.

 Quality & Reliability: Test technologies for packaging, quality monitoring and evaluation, methodologies for reliability data collection and analysis, reliability modeling, life prediction, failure analysis and non-destructive diagnose.

 Power Electronics & The new energy and new power system: Thermal management, interconnection and substrate technologies for power electronics, switch module, isolated/non-isolated power converter, inverter module, IPM, POL, PwrSoC, PSiP, open frame, electrical design, magnetic integration, control algorithm, firmware development, EMI modeling & optimization.

Materials and Technologies for Energy Conversion Storage and Transport. Design, modeling, algorithm and simulation of wind, light, heat, RF signal, vibration signal and other energy harvesting devices, as well as multi-scale and multi-physical field analysis. New power system and 5G communication convergence technology. Key technology of energy Internet of things. Modeling and optimization method of smart distribution network for new energy consumption. Technology of Interrelationship between modeling and algorithm of power-electronized power System.

 Optoelectronics and New Display: Optoelectronics and solid state lighting design, simulation, interconnection, packaging & integration, display module encapsulation & assembly, encapsulation of detector and imaging device at IR/VIS/UV or X-ray band, photo cell encapsulation, new display device and module encapsulation & assembly, mass Transfer of MicroLED, wearable, bendable, foldable and flexible electronics and display.

 MEMS, Sensors and IoT: MEMS, NEMS, sensor, sensor packaging, implantable device packaging, microfluidics, nano-battery. 3D printing, self- alignment and assembly, wafer-level and panel-level packaging for MEMS and sensors.

 Emerging Technologies & Applications of Electronic Technology for Artificial Intelligence:Electrical modeling, analysis, design, integration, fabrication and characterization of novel devices, packages, and systems for RF/microwave and high-speed I/O, component optimization and power management of computing/communication systems, 5G mobile networking, wearable/flexible electronics and bio-electronics, etc.

Semiconductor packaging job scheduling, big data system, network security system, artificial intelligence system, encryption and decryption system, biometric identification system, agricultural Internet of Things system, and chip system packaging optimization and management based on artificial intelligence, analog/digital/mixed-signal integrated circuit design, communication system modeling, analysis and design.


IMPORTANT DATES

     March 31st, 2023 Deadline for Submission of Abstract

     April 30th, 2023 Notification of Abstract Acceptance

     May 20th, 2023 Deadline for Submission of Full Paper

 

SUBMISSION OF ABSTRACT

Abstracts are solicited to describe original and unpublished work. The abstract should be approx. 500 words and contains a clear statement of the background, methodology, results, and conclusions. All abstracts and manuscripts must be in English and should be submitted through online submission system. The instructions for abstract submission can be found at the conference website http://www.icept.org. All accepted manuscripts will be submitted for inclusion into IEEE Xplore. Selected papers will be recommended for publication in related IEEE/EPS journals.

Abstract Submission Website: https://easychair.org/my/conference?conf=icept20230


BEST PAPER AWARD

Best Papers and Posters will be selected and awarded at the conference.


CALL FOR EXHIBITION/SPONSORSHIP

A tabletop exhibition featuring suppliers of materials, equipment, components, software, manufacturers, and service providers of the electronics packaging and related industries will be held during the conference. Potential exhibitors and sponsors may e-mail to janey@fsemi.tech for details.


CONTACT US

  Shihezi University

    Address:  4th Beisi Road, Shihezi City, Xinjiang Province, PRC. 832003

      Hongkun WANG  Tel:0086-993-2057238

                                  Email:icept@fsemi.tech

      Pang GAO  Tel:0086-993-2055710

  Institute of microelectronics, Chinese Academy of Sciences

    Wen YIN  Tel: 0086-10-82995675

  Registration: 

    Yico WANG  Tel: 0086-10-64655251

                         Email: Support@fsemi.tech 

    Zhaoquan ZENG  Tel: 0086-18167726155

  Sponsorship:

    Janey SHI  Tel: 0086-13661508648

                      Email: Janey@fsemi.tech

    Judy ZHOU  Tel: 0086-010-64655251

                         Email: juanjuan.zhou@fsemi.tech 


ABOUT SHIHEZI UNIVERSITY

Shihezi University is the 2nd largest university in Xinjiang province, University Schools predecessor was Established in September 1949 on his way into the People’s Liberation Army liberation of Xinjiang, in April 1996 under the Ministry of Agriculture, Shihezi Agricultural College, Shihezi Medical College, the Corps and the Corps economic College Teachers College merged to form Shihezi University is the national “211 Project” key construction universities and colleges and universities in western countries.

The Shihezi University currently has 11 majors in economics, law, education, literature, history, science, engineering, agriculture, medicine, management, and art. The school has 94 undergraduate majors, 8 first-level discipline doctoral degree authorization points, 26 first-level discipline master degree authorization points, 20 master degree authorization categories, 4 post-doctoral research mobile stations, and 2 post-doctoral research workstations.

 

ABOUT XINJIANG

Meeting Details

Xinjiang Uygur Autonomous Region, with Urumqi as its capital, located in the northwest of China, covering an area of 1.6649 million square kilometers. It is the largest provincial administrative region in China's land area, accounting for about one-sixth of China's total land area. Xinjiang also located in the hinterland of the Asia-Europe continent, with a land border of more than 5600 kilometers, bordering Russia, Kazakhstan, Kyrgyzstan, Tajikistan, Pakistan, Mongolia, India and Afghanistan. It has been an important passage of the ancient Silk Road in history, and now is the necessary place for the second 'Asia-Europe continental bridge'. Its strategic position is very important. Xinjiang has 56 ethnic groups, mainly inhabited by Han, Uygur, Kazak, Hui, Mongolian and other nationalities, and is one of China's five ethnic autonomous regions.

Xinjiang is renowned rural of song and dance, home of melons and fruits, and a land full of gold and jade. Xinjiang has 56 types of national tourism resources, accounting for 83% of the national tourism resources. There are more than 1100 scenic spots in Xinjiang, ranking first in the country. Here is the second highest peak in the world with an altitude of 8600 meters, and the lowest depression in China with an altitude of 154 meters below sea level.


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