Plenary Talks

  • Design Challenges for Advanced Packaging of Electronic Systems
    Prof. Chris Bailey (Online), President of IEEE EPS, University of Greenwich, UK
  • The new reality (Challenges and Opportunities) of Global Semiconductor Industry
    Lung Chu, SEMI China, China
  • Latest Progress on the Standardization of Packaging Technology Within JEDEC
    Dr. Kayleen L. E. Helms (Online), Intel, USA
  • 1D, 2D and 3D Carbon Materials for Supercapacitor and Cooling applications
    Prof. Johan Liu (Online), Chalmers University of Technology, Sweden, Shanghai University, China
  • Hybrid Bonding in Ambient Atmosphere for Cross-Cutting Applications
    Dr. Akitsu Shigetou (Online), National Institute for Materials Science, Japan
  • Digital Twin Enabled Heterogenous System Integration
    Prof. Kouchi Zhang, Delft University of Technology, Netherlands
  • New Results on Electromigration Modeling – A Departure from Blech’s Theory
    Prof. Xuejun Fan (Online), Lamar University, USA
  • Prospect of Panel Level Fan-Out Packaging in the AI/5G Era
    Dr. Farhang Yazdani (Online), BroadPak Corporation, USA
  • Heterogeneous Integration Roadmap – Driving Force and Enabling Technology for System of the Future
    William Chen (Online), ASE Group, China
  • Radio-Front-End-Module in Package for 5G and B5G Applications
    Prof. Fujiang Lin, University of Science and Technology of China (USTC), China
  • Modeling Based Research and Development for Key Electronic Manufacturing Equipment
    Prof. Sheng Liu, Wuhan University, China
  • The Integrated Circuits and Packaging Affecting Healthcare
    Prof. Zhihua Wang, Tsinghua University, China