Technical Progarm Committee

1 — Advanced  Packaging
Chairs Li Zhang JCET, Shaoxing， China
Jintang Shang  Southeast University，China
Qian Wang Tsinghua University, China
Members Hao Tang Micro Materials Inc., USA
Teng Wang MIXOSENSE
Junghyunn Chae TFME
Zirong Tang HUST，China
Junqiang Wang North University of China
Yan Wang Central South University, China
Yinghui Wang IME， CAS
Pengli ZHU Shenzhen institute of advanced technology, CAS

2 — Packaging Materials & Processes
Chairs Tao Hang Shanghai Jiao Tong University
Yu Zhang Guangdong University of Technology
Members Liangliang LI Tsinghua University
Zhuo LI Fudan University
Yanhong TIAN Harbin Institute of Technology
Mingliang HUANG Dalian University of Technology
Guoping ZHANG Shenzhen institute of advanced technology, CAS
Fengwen MU Institute of Microelectronics, CAS
Cong ZHANG Western Digital
Su WANG Shanghai Sinyang Semiconductor Materials Co., Ltd.
Wei TAN Jiangsu HHCK Advanced Materials Co., Ltd.

3 — Packaging Design & Modeling
Chairs Daoguo Yang Guilin University of Electronic Technology, China
Tonglong Zhang Huawei, China
Members Jiantao Zheng Hisilicon, China
Pei Chen Beijing University of Technology, China
Hua Lu  Greenwich University, UK
Xiaowu Zhang Institute of Microelectronics (IME)
Haibo Fan Nexperia Hong Kong
Xinping Zhang South China University of Technology, China
Hu He Central South University, China
Cheng Qian Beihang University, China
Jue Li Huawei, Finland
Daohui Li  Dynex Semiconductor Ltd, UK
Xu Long Northwestern Polytechnical University,  China
Hongbo Qing Guilin University of Electronic Technology, China

4 — Interconnection Technologies
Chairs Jian CAI Tsinghua University,China
Kelvin PUN Compass Technology Company Ltd.,China
Members Lingzhi CHEN Jiangsu Changjiang Elect.Tech., China
Zhuo CHEN Central South University, China
Xin GU Shennan Circuit Co.,Ltd, China
Hao LIU Ramaxel, China
Yingxia LIU Beijing Institute of Technology, China
Ziyu LIU Fudan University,China
Shenglin MA Xiamen University, China
Shuying MA Huatian Technology (Kunshan) Electronics Co., Ltd,China
CS TAN National Technology University, Singapore
Chenxi WANG Harbin Institute of Technology,China
Chaoqi ZHANG Qualcomm Inc., USA
Dingyou ZHANG Broadcom Inc. ,USA

5 — Advanced Manufacturing & Packaging Equipment
Chairs Sheng Liu Wuhan University
Yi Song Wuhan University
Members Jinrong Zhao NAURA Technology Group Co., Ltd.
Zhiyin Gan Huazhong University of Science and Technology
Daquan Yu Xiamen University
Shuying Ma Huatian Technology（Kunshan） Co.,Ltd
Hongjie Wang TF – AMD
Fulong Zhu Huazhong University of Science and Technology
Haitao Shi JCET Group Co., Ltd.
Xinjun Zhou InnoLight Technology (Suzhou)

6 — Quality & Reliability
Chairs Bin XIE Hong Kong Applied Science and Technology Research Institute
Jian GAO Guangdong University of Technology
Huaiyu YE Shenzhen Institute of Wide-Bandgap Semiconductors
Members Bin LIU Intel Asia-Pacific Research & Development Ltd.
Weiqiang LI Huawei Technologies Co., Ltd.
Jianli ZHANG BYD Company Limited
Andy DAI Coresing Semiconductor Technology Co.Ltd
Zhiwen CHEN Wuhan University
Ke XUE Southern University of Science and Technology
Yunfei En The Fifth Institute of MIIT
Wayne LIN Shenzhen Institute of Wide-Bandgap Semiconductors
Puqi NING Institute of Electrical Engineering, Chinese Academy of Sciences
Miao Cai Guilin University of Electronic Technology, China

7 — Power Electronics
Chairs Ziyang Gao  Applied Science and Technology Research Institute (ASTRI),HK
Bo Sun Guang Dong University of Technology, China
Members Yuhua Cheng Peking Univ, China
Qinsong Qian Southeast University, China
Shunfeng Li Huagong Semi, China
Hongyu Yu South University of Science and Technology of China, China
Jefferson Hsu Great Team Backend Foundry, Inc., TW
Zhaozhen Hou  Huawei, China
Bin Zhang ZTE, China
Yunhui Mei  Tianjin Univ., China
Weiwei He Basic, China
River Li  Applied Science and Technology Research Institute (ASTRI), HK
Joyce Wang EPC Corporation, USA
Jimmy Liu GaN Systems, Canada

8 — Optoelectronics and New Display
Chairs Fengman Liu Institute Of Microelectronics Of Chinese Academy Of Sciences
Hongbin Chen Cedar electronics
Members Zhaojun Liu Sustc University，Korea
Yu Sun  National center for advanced packaging
Yi Luo Dalian University of Technology
Liancheng Wang Central South University
Guoqiao Tao Ampleon Netherlands BV
Jifang Tao Shangdong University
Haiyun Xue Institute Of Microelectronics Of Chinese Academy Of Sciences
Yaming Fan Sinano
Ping Chen Institute Of Semiconductors Of Chinese Academy Of Sciences

9 — MEMS&Fan-out  Packaging
Chairs Tingyu Lin Guangdong Fozhixin, China
Alex Yu Shanghai Micro-system Institute
Daping Yao Zhongke Zhixin, China
Members Goujun Hu Smart Drive Sensing (wuxi) Co. Ltd.
Fengwei Dai NCAP, China
Fengze Hou Delft University of Technology， Holland
Yue Sun Shenzhen institute of wide-bandgap semiconductors(iWins)
Feng Jiang Xiamen Sky Semiconductor Technology Co.Ltd.
Tim Chen Debang Material Co., Ltd
Farhang Yazdani Broadpak Co.Ltd (USA)
Braun Tanja IZM.fraunhofer, German
Thorsten.Meyer Infineon Co., Ltd, German
Xuyuan Sun NCAP, China
Hengyun Zhang Shanghai University of Engineering & Tech
Guochi Huang Fujian Normal University
Tong Cui C&BTECH Technologies Co.,Ltd（USA）
Fujiwara San JSR (Japan) Co. Ltd

10 — Emerging Technologies
Chairs Yan ZHANG Shanghai University
Guannan YANG Guangdong University of Technology
Members Jun Wang Fudan University
Gaowei XU Shanghai Institute of Microsystem & Information Technology, Chinese Academy of Sciences
Xiuzhen LU Shanghai University
Hongbin SHI Huawei Technologies Co., Ltd.
Hongwen HE Hisilicon Technologies Co., Ltd.
Shuhui Yu Shenzhen institute of advanced technology, CAS
Hui Tang Guangdong University of Technology
Xun Huan Guangdong Fozhixin, China