|
Name |
Organization |
Chairs |
Chengqiang CUI |
Prof. of Guangdong University of Technology, China |
Liqiang CAO |
Prof. of Institute of Microelectronics of Chinese Academy of Sciences, China |
Co-Chairs |
Chiming LAI |
Vice President of Jiangsu Changjiang Electronics Technology Co., Ltd (JCAP), China |
Fei XIAO |
Prof. of Fudan University, China |
Sheng LIU |
Prof. of Wuhan University , China |
Jian CAI |
Prof. of Tsinghua University, China |
Yong LIU |
Chief engineer of Fairchild, USA |
Yanhong TIAN |
Prof. of Harbin Institute of Technology, China |
Rong SUN |
Prof. of Shenzhen Institutes of Advanced Technology, CAS, China |
Fei QIN |
Prof. of Beijing University of Technology, China |
Daquan YU |
CTO of Hua Tian Technology ,China |
Daoguo YANG |
Prof. of Guilin University of Electronic Technology, China |
Ming LI |
Prof. of Shanghai Jiao Tong University, China |
Daniel SHI |
Senior Director of ASTRI, HK, China |
Secretary |
Yu ZHANG |
A/Prof. of Guangdong University of Technology, China |
Bo SUN |
A/Prof. of Guangdong University of Technology, China |
1 — Advanced Packaging |
Chairs |
Li ZHANG |
JCET, Shaoxing, China |
Jintang SHANG |
Southeast University,China |
Qian WANG |
Tsinghua University, China |
Members |
Hao TANG |
Micro Materials Inc., USA |
Teng WANG |
MIXOSENSE |
Junghyunn CHAE |
TFME |
Zirong TANG |
HUST, China |
JunqiANG WANG |
North University of China, China |
Yan WANG |
Central South University, China |
Yinghui WANG |
IME, CAS, China |
Pengli ZHU |
Shenzhen institute of advanced technology, CAS, China |
Sha XU |
Guangdong University of Technology, China |
2 Packaging Materials & Processes |
Chairs |
Tao HANG |
Shanghai Jiao Tong University, China |
Yu ZHANG |
Guangdong University of Technology, China |
Members |
Liangliang LI |
Tsinghua University, China |
Zhuo LI |
Fudan University, China |
Yanhong TIAN |
Harbin Institute of Technology, China |
Mingliang HUANG |
Dalian University of Technology, China |
Guoping ZHANG |
Shenzhen institute of advanced technology, CAS, China |
Fengwen MU |
Institute of Microelectronics, CAS, China |
Cong ZHANG |
Western Digital |
Su WANG |
Shanghai Sinyang Semiconductor Materials Co., Ltd., China |
Wei TAN |
Jiangsu HHCK Advanced Materials Co., Ltd., China |
3 Packaging Design & Modeling |
Chairs |
Daoguo YANG |
Guilin University of Electronic Technology, China |
Tonglong ZHANG |
Huawei, China |
Members |
Jiantao ZHENG |
Hisilicon, China |
Pei CHEN |
Beijing University of Technology, China |
Hua LU |
Greenwich University, UK |
Xiaowu ZHANG |
Institute of Microelectronics (IME), China |
Haibo FAN |
Nexperia Hong Kong, China |
Xinping ZHANG |
South China University of Technology, China |
Hu HE |
Central South University, China |
Cheng QIAN |
Beihang University, China |
Jue LI |
Huawei, Finland |
Daohui LI |
Dynex Semiconductor Ltd, UK |
Xu LONG |
Northwestern Polytechnical University, China |
Hongbo QING |
Guilin University of Electronic Technology, China |
4 Interconnection Technologies |
Chairs |
Jian CAI |
Tsinghua University,China |
Kelvin PUN |
Compass Technology Company Ltd.,China |
Members |
Lingzhi CHEN |
Jiangsu Changjiang Elect.Tech., China |
Zhuo CHEN |
Central South University, China |
Xin GU |
Shennan Circuit Co.,Ltd, China |
Hao LIU |
Ramaxel, China |
Yingxia LIU |
Beijing Institute of Technology, China |
Ziyu LIU |
Fudan University, China |
Shenglin MA |
Xiamen University, China |
Shuying MA |
Huatian Technology (Kunshan) Electronics Co., Ltd,China |
CS TAN |
National Technology University, Singapore |
Chenxi WANG |
Harbin Institute of Technology, China |
Chaoqi ZHANG |
Qualcomm Inc., USA |
Dingyou ZHANG |
Broadcom Inc. ,USA |
5 Advanced Manufacturing & Packaging Equipment |
Chairs |
Sheng LIU |
Wuhan University, China |
Yi SONG |
Wuhan University, China |
Members |
Jinrong Zhao |
NAURA Technology Group Co., Ltd. |
Zhiyin GAN |
Huazhong University of Science and Technology, China |
Daquan YU |
Xiamen University, China |
Shuying MA |
Huatian Technology(Kunshan) Co.,Ltd |
Hongjie WANG |
TF – AMD |
Fulong ZHU |
Huazhong University of Science and Technology, China |
Haitao SHI |
JCET Group Co., Ltd. |
Xinjun ZHOU |
InnoLight Technology (Suzhou) |
6 Quality & Reliability |
Chairs |
Bin XIE |
Hong Kong Applied Science and Technology Research Institute, China |
Jian GAO |
Guangdong University of Technology, China |
Huaiyu YE |
Shenzhen Institute of Wide-Bandgap Semiconductors, China |
Members |
Bin LIU |
Intel Asia-Pacific Research & Development Ltd. |
Weiqiang LI |
Huawei Technologies Co., Ltd., China |
Jianli ZHANG |
BYD Company Limited, China |
Andy DAI |
Coresing Semiconductor Technology Co.Ltd |
Zhiwen CHEN |
Wuhan University, China |
Ke XUE |
Southern University of Science and Technology, China |
Yunfei EN |
The Fifth Institute of MIIT, China |
Wayne LIN |
Shenzhen Institute of Wide-Bandgap Semiconductors, China |
Puqi NING |
Institute of Electrical Engineering, CAS, China |
Miao CAI |
Guilin University of Electronic Technology, China |
7 Power Electronics |
Chairs |
Ziyang GAO |
Applied Science and Technology Research Institute (ASTRI), HK, China |
Bo SUN |
Guangdong University of Technology, China |
Members |
Yuhua CHENG |
Peking University, China |
Qinsong QIAN |
Southeast University, China |
Shunfeng LI |
Huagong Semi, China |
Hongyu YU |
South University of Science and Technology, China |
Jefferson HSU |
Great Team Backend Foundry, Inc., China |
Zhaozhen HOU |
Huawei, China |
Bin ZHANG |
ZTE, China |
Yunhui MEI |
Tianjin University, China |
Weiwei HE |
Basic, China |
River LI |
Applied Science and Technology Research Institute (ASTRI), HK, China |
Joyce WANG |
EPC Corporation, USA |
Jimmy LIU |
GaN Systems, Canada |
8 Optoelectronics and New Display |
Chairs |
Fengman LIU |
Institute of Microelectronics, CAS, China |
Hongbin CHEN |
Cedar Electronics |
Members |
Zhaojun LIU |
Sustc University, Korea |
Yu SUN |
National Center for Advanced Packaging (NCAP), China |
Yi LUO |
Dalian University of Technology, China |
Liancheng WANG |
Central South University, China |
Guoqiao TAO |
Ampleon, Netherlands |
Jifang TAO |
Shangdong University, China |
Haiyun XUE |
Institute of Microelectronics, CAS, China |
Yaming FAN |
Sinano |
Ping CHEN |
Institute of Microelectronics, CAS, China |
9 MEMS&Fan-out Packaging |
Chairs |
Tingyu LIN |
Guangdong Fozhixin, China |
Alex YU |
Shanghai Micro-system Institute |
Daping YAO |
Zhongke Zhixin, China |
Members |
Goujun HU |
Smart Drive Sensing (wuxi) Co. Ltd., China |
Fengwei DAI |
National Center for Advanced Packaging (NCAP), China |
Fengze HOU |
Delft University of Technology, Netherland |
Yue SUN |
Shenzhen institute of wide-bandgap semiconductors(iWins), China |
Feng JIANG |
Xiamen Sky Semiconductor Technology Co.Ltd. , China |
Tim CHEN |
Debang Material Co., Ltd |
Farhang YAZDANI |
Broadpak Co.Ltd, USA |
Braun TANJA |
IZM.fraunhofer, German |
Thorsten MEYER |
Infineon Co., Ltd, German |
Xuyuan SUN |
National Center for Advanced Packaging (NCAP), China |
Hengyun ZHANG |
Shanghai University of Engineering and Technology, China |
Guochi HUANG |
Fujian Normal University |
Tong CUI |
C&BTECH Technologies Co.,Ltd, USA |
Fujiwara SAN |
JSR (Japan) Co. Ltd, Japan |
10 Emerging Technologies |
Chairs |
Yan ZHANG |
Shanghai University, China |
Guannan YANG |
Guangdong University of Technology, China |
Members |
Jun WANG |
Fudan University, China |
Gaowei XU |
Shanghai Institute of Microsystem & Information Technology, CAS, China |
Xiuzhen LU |
Shanghai University, China |
Jun ZHANG |
Guangdong University of Technology, China |
Hongbin SHI |
Huawei Technologies Co., Ltd., China |
Hongwen HE |
Hisilicon Technologies Co., Ltd., China |
Shuhui YU |
Shenzhen institute of advanced technology, CAS, China |
Hui TANG |
Guangdong University of Technology, China |
Xun HUAN |
Guangdong Fozhixin, China |