Packaging Materials – Morning Session
Packaging Materials – Afternoon Session
3D Packaging – Morning Session
Reliability of Electronics Packages – Afternoon Session
ASTRI:如何开发具有自主知识产权的电子封装创新技术及产品:– Afternoon Session
iNEMI Roadmap
Time
08:30--17:00 July 28, 2008
ITRS Roadmap – Afternoon Session
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