Short Courses
Packaging Materials ¨C Morning Session
Prof. C. P. WONG
Dr. Daniel LU

 

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Packaging Materials ¨C Afternoon Session
Dr. Ning-Cheng LEE
Prof. Johan LIU

 

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3D Packaging ¨C Morning Session
Prof. Ricky LEE
Dr. Ken CHEUNG

 

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Reliability of Electronics Packages ¨C Afternoon Session
Dr. Rainer DUDEK
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iNEMI Roadmap
Time
08:30--17:00  July 28, 2008
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ASTRI - Afternoon Session
How to Develop Innovative Electronics Packaging-related Technologies/Products
via Technical Marketing, Patent and Product Analyses
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ITRS Roadmap ¨C Afternoon session
Dr. Bill CHEN
Only for invited attendees
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