Conference Organization
Conference Chairs
qGeneral Chair – Prof. Keyun BI 
qExecutive Chair – Prof.Li JIN 
qCo-chairs –William T. CHEN, Steve ADAMSON, Kouchi ZHANG, Wenjun ZHANG, Johan LIU
qTechnical Chair – Dr. Tom CHUNG
qOrganizing Chair – Prof.Xiaojing WU 
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International Advisory Board

Shichang ZOU
Academician of Chinese Academy of Sciences, President of Shanghai Integrated Circuit Industry Association (SICA), China

Rao TUMMALA

Pettit Chair Professor and Director of Packaging Research Center, Georgia Institute of Technology, USA

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Technical Committee
Chair – Dr. Tom CHUNG, ASTRI
Co-chairs and members
Advanced Packaging & System Integration Committee
Packaging Design & Modeling Committee
Packaging Materials & Processes Committee
High Density Substrate & SMT Committee
Emerging Technologies Committee
Advanced Manufacturing Technologies Committee
Equipment, Measurement & Characterization Committee
Quality & Reliability Committee
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Organizing Committee
Chair – Prof. WU Xiaojing, Fudan Univ.
Co-chairs and members
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Secretariat and Conference Affairs
qSecretariat
qConference Affairs
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