CONFERENCE THEMES
You are invited to submit an abstract, describing new development in the following themes:
Advanced Packaging & System Integration
High Density Substrate & SMT
...
IMPORTANT DATES
qApril 25, 2008 ¨C Submission of Abstract
qMay 09, 2008 ¨C Notification of Acceptance
qJune 27, 2008 ¨C Submission of Manuscript
Special Reminder: In case you need invitation letter for visa application, please send your full name, passport No, DOB, Country of citizenship to icept2008@fudan.edu.cn by latest 30th of May, 2008.
SUBMISSION OF ABSTRACT/PAPER
Abstracts are solicited to describe original and unpublished work. The abstract should be approx. 500 words and contains a clear statement of the background, methodology, results, conclusions and important references of the work. All abstracts must be in English and should be submitted using the format provided in the attached word file through the email: icept2008@fudan.edu.cn and/or feixiao@fudan.edu.cn.
CALL FOR EXHIBITION/SPONSORSHIP
A tabletop exhibition featuring suppliers of materials, equipment, components and software, manufacturers, and service providers of the electronics packaging and related industries will be held during the conference. ...
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