Directed by
Chinese Institute of Electronics
Science & Technology Department, Ministry of Education of the People’s Republic of China
Shanghai Municipality, China
Department of High and New Technology Development & Industrialization, Ministry of Science and Technology of the People’s Republic of China
Department of Electronics Information Products, Ministry of Information Industry of the People’s Republic of China
China International Culture Exchange Center

Sponsored by
China Electronics Packaging Society (CEPS), Chinese Institute of Electronics
Shanghai Jiao Tong University (SJTU), China
The IEEE Components, Packaging, and Manufacturing Technology Society (IEEE-CPMT)
International Microelectronics and Packaging Society (IMAPS)

Organized by
Shanghai Jiao Tong University (SJTU), China
Beijing Faith Counseling Co., Ltd

Co-sponsored by
Hong Kong Applied Science & Technology Research Institute (ASTRI), China
Shanghai Zhangjiang(Group)Co.,Ltd
Japan Institute of Electronics Packaging (JIEP)
Singapore Institute of Microelectronics (IME)
Shanghai Municipal Science & Technology Commission, China
Shanghai Foreign Expert Bureau
China Academy of Electronics & Information Technology (CAEIT)
Hebei Semiconductor Research Institute (HSRI), China
Wuxi Microelectronic Scientific Research Center, China
No. 45 Research Institute of CETC, China
Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, China
Shanghai Institute of Electronics, China
Shanghai Integrated Circuit Industry Association (SICA), China
Institute of Metal Research, Chinese Academy of Sciences
Tsinghua University, China
Fudan University, China
Harbin Institute of Technology, China
Huazhong University of Science and Technology, China
University of Electronic Science and Technology of China
Xidian University, China
Guilin University of Electronic Science and Technology, China
Nantong University, China