Chair of Conference
Keyun Bi
Standing Committee Member of Chinese Institute of Electronics
President of China Electronics Packaging Society

Executive Chair of Conference
Wenjun Zhang
Vice-President of Shanghai Jiao Tong University, China

Co-chairs of Conference
William T. Chen
President of IEEE-CPMT
Mike Ehlert
President Elect of IMAPS
G. Q. (Kouchi) Zhang
Professor of NXP Semiconductors and Delft University of Technology, Netherlands
Ricky S. W. Lee
Professor of Hong Kong University of Science and Technology (HKUST), China
Tom Chung
Vice-President of Hong Kong Applied Science & Technology Research Institute (ASTRI), China
Kuo-Ning Chiang
Chair of IMAPS-Taiwan, Tsinghua University, Taiwan, China
Rolf Aschenbrenner
IEEE-CPMT, Germany
K. Suganuma
Professor of Osaka University, Japan
Tianan（Tim）Chen
General Manager, Henkel Technologies-Electronics
Zhihua Bao
Vice-President of Nantong University, China

International Advisory Committee
Shichang Zou
Academician of Chinese Academy of Sciences, President of Shanghai Integrated Circuit Industry Association (SICA), China
Ke Lu
Academician of Chinese Academy of Sciences, Director of School of Materials Science and Engineering, Shanghai Jiao Tong University, China
Rao Tummala
Pettit Chair Professor and Director of Packaging Research Center, Georgia Institute of Technology, USA
Michael Pecht
Professor of University of Maryland, USA
Tadatomo Suga
Professor of University of Tokyo, Japan
Wenwu Ding
Vice-Director of Electronics Information Products Department, Ministry of Information Industry of the People’s Republic of China
Guoqiang Dai
Vice-Director of Department of High and New Technology Development & Industrialization, Ministry of Science and Technology of the People’s Republic of China
C. P. Wong
Professor of Georgia Institute of Technology, USA
Andrew Tay
Professor of National University of Singapore, Singapore
Wayne Koh
Director, Kingston Technology Company, Inc., USA
Derek Or
Chair of IEEE-CPMT-Hong Kong Chapter
Shengli Fu
President of I-Shou University, Taiwan, China
Liangyu Yan
Shanghai Jiao Tong University, China
Bernd Michel
Fraunhofer IZM, Germany
Kees Beenakker
Delft University of Technology, Netherlands
Olivier de Saint Leger
Astefo, France
Eef Bagerman
NXP Semiconductors, Netherlands
Jusheng Ma
Professor of Tsinghua University, China
Chris Bailey
University of Greenwich,UK

Academic Committee
Chair
Shangtong Gao Hebei Semiconductor Research Institute (HSRI), China
Co-chair
Ming Li Shanghai Jiao Tong University, China
Chunqing Wang Harbin Institute of Technology, China
Xuejun Fan Intel (USA)
Jiaji Wang Fudan University, China
Sheng Liu Huazhong University of Science and Technology, China
Chih-Ming Lai Jiangsu Changdian Advanced Packaging Technology Co., Ltd, China
Zhonghua Xu Tokyo University, Japan
Max Juergen Wolf Franhofer IZM, Germany
Willem D. van Driel NXP Semiconductors and Delft University of Technology, Netherlands
Stephen Wong Singapore Institute of Manufacturing Technology, Singapore
John Pang Nanyang Technological University, Singapore
Han Ding Shanghai Jiao Tong University, China
Yiping Wu Huazhong University of Science and Technology, China
Jian Cai Tsinghua University, China
Le Luo Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, China
Shiyong Yang Institute of Chemistry, Chinese Academy of Sciences, China
Member
Lining Sun Harbin Institute of Technology, China
Hongyu Zheng Hebei Semiconductor Research Institute (HSRI), China
Zhuoshen Shen Beijing University of Science and Technology, China
Jim Leu Chiao Tung University, Taiwan, China
Zhong Chen Nanyang Technological University, Singapore
Xiulan Cheng Shanghai Jiao Tong University, China
Daniel Lu Intel (USA)
Guifu Ding Shanghai Jiao Tong University, China
Yong Liu Fairchild Semiconductor Corporation, USA
Taekoo Lee Samsung，Korea
Lei Shan IBM (USA)
Xingjun Liu Xiamen University, China
Weiping Jing Nantong University, China
Hong Wang Shanghai Meadville Science & Technology C0., Ltd

Organizing Committee
Chair
Ming Li Shanghai Jiao Tong University, China
Co-chair
Shangtong Gao Hebei Semiconductor Research Institute (HSRI), China
Xiang Wu China Electronics Packaging Society (CEPS), China
Xingzao Huang Beijing Faith Counseling Co., Ltd, China
Aidang Shan Shanghai Jiao Tong University, China
Pingnan Zhou Shanghai Jiao Tong University, China
Fuhan Liu Georgia Institute of Technology, USA
Mingyu Li Harbin Institute of Technology, China
Member
Yongxing Guo No. 45 ResearchInstitute of CETC, China
Xinchao Wang Jiangsu Changdian Advanced Packaging Technology Co., Ltd, China
Mingda Shi Nantong Fujitsu Microelectronics Co., Ltd, China
Shengli Xiao Tianshui Huatian Science & Technology Co., Ltd, China
Jianglong Han Henkel Technology-Electronics(China)
Xiaojian Zhang Wuxi China Resources Micro-assembly Technology Co., Ltd
Ivan M. L. Sham Hong Kong Applied Science & Technology Research Institute ( ASTRI), China
Gang Huang Beijing Faith Counseling Co., Ltd, China
Qing Li Beijing Office, China Electronics Packaging Society, Chinese Institute of Electronics

Secretariat
Secretary-general
Dongyan Ding Shanghai Jiao Tong University, China
Vice Secretary-general
Daniel Shi  HongKong Applied Science & Technology Research Institute(ASTRI),China.
Secretary
Anmin Hu Shanghai Jiao Tong University, China
Chengkang Chang Shanghai Jiao Tong University, China
Huiqin Ling Shanghai Jiao Tong University, China
Run Du Beijing Office, China Electronics Packaging Society, Chinese Institute of Electronics

Conference Affairs
Manager
Xingzao Huang Beijing Faith Counseling Co., Ltd, China
Vice-Manager
Qing Li Beijing Office, China Electronics Packaging Society, Chinese Institute of Electronics
Member
Geying Li Beijing Office, China Electronics Packaging Society, Chinese Institute of Electronics
Gang Huang Beijing Faith Counseling Co., Ltd, China
Fenghua Gan Beijing Faith Counseling Co., Ltd, China
Li Ma Beijing Faith Counseling Co., Ltd, China
Jingping Hou Beijing Faith Counseling Co., Ltd, China
Shuang Zhang Beijing Faith Counseling Co., Ltd, China
Xing Chen Beijing Faith Counseling Co., Ltd, China
Tao Hang Shanghai Jiao Tong University, China