Committees

CONFERENCE ORGANIZERS

Directed by   会议指导单位
Department of Higher Education, Ministry of Education, China 中华人民共和国教育部高等教育司
Department of Information Technology Industry, Ministry of Industry and Information Technology, China 中华人民共和国工业和信息化部电子信息司
Science and Technology Commission Shanghai Municipality, China 上海市科学技术委员会
Chinese Institute of Electronics, China 中国电子学会
Hosted by   会议主办单位
Institute of Microelectronics of Chinese Academy of Sciences (IMECAS), China 中国科学院微电子研究所
Fudan University, China 复旦大学
IEEE Electronics Packaging Society  (IEEE EPS) 国际电气和电子工程师协会电子封装协会
Electronic Manufacturing & Packaging Technology Society of China Institute of Electronics,China (CIE-EMPT) 中国电子学会电子制造与封装技术分会
Organized by   会议承办单位
State Key Laboratory of ASIC and System, Fudan University, China 复旦大学专用集成电路与系统国家重点实验室
National Center for Advanced Packaging (NCAP), China 华进半导体封装先导技术研发中心有限公司

General Committee

International Advisory Committees

Technical Committee

Organizing Committee