Professional Development Courses

OVERVIEW OF PROFESSIONAL DEVELOPMENT COURSE

Wednesday, August 8, 2018

 

pdc

 

Introduction:

PDC-1:Achieving High Reliability for Lead-Free Solder Joints – Materials Consideration

Dr. Ning-Cheng LEE

 

PDC-2:Heterogeneous Integration:  Challenges and Opportunities

Dr. Lei SHAN

 

PDC-3:Advanced Wafer level Packaging Using Through Silicon Vias and Fan-Out Technology

Dr. Daquan YU

 

PDC-4:Power Electronic Packaging Reliability, Materials, Assembly and Simulation

Dr. Yong LIU & Dr. Ning-cheng LEE & Prof. Sheng LIU

 

PDC-5:HPC, AI and High Performance IC Packaging Technology

Dr. Yifan GUO

 

PDC-6:System Optimization and Differentiation through 3D SiP

Dr. Li LI

 

PDC-7:Polymers and Nano-Composites For Electronic and Photonic Packaging

Prof. C.P. WONG & Dr. Daniel LU