Plenary Talks


Thursday, August 9, 2018



09:00–09:30 Opening Ceremony
09:30–10:00 Gen3 Thermal Management: Migrating from “Hot Aisles” to On-Chip Cooling

Dr. Avram Bar-Cohen

Raytheon – Space and Airborne Systems, IEEE Electronic Packaging Society President, Arlington, VA, USA

10:00–10:25 Composition Tuned Hybrid Perovskites: From Interface and Grain Engineering to Stability and Performance Improvement

Prof. C. P. Wong

Chinese University of Hong Kong

10:25–10:45 Coffee Break
10:45–11:10 Moore’s Law for Packaging from 16 to 16,000 I/Os in 5 Decades

Prof. Rao Tummala

Georgia Institute of Technology

11:10–11:35 Towards Industrialization of Panel Level Packaging

Dr. Rolf Aschenbrenner

Fraunhofer Institute for Reliability and Microintegration Berlin (IZM)

11:35–12:00 Development Trends of Integrated Circuits Technology

Prof. David Wei Zhang

Fudan University

11:40–13:10 Lunch


13:30–13:55 Heterogeneous Integration through SiP – A Vision for the Future

Dr. William Chen

ASE Group

13:55–14:20 Low dimensional carbon materials for electronics heat dissipation and interconnect applications

Prof. Johan Liu

Chalmers University of Technology

14:20–14:45 Low temperature heterogeneous integration for optical microsystems

Prof. Eiji Higurashi

The University of Tokyo

14:45–15:10 SiP Boom is around the corner

Dr. Lingzhi Chen

Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET)

15:10–15:30 Coffee Break
15:30–15:55 The latest packaging material technologies for electronics devices

Dr. Osamu Suzuki

R&D Unit at Namics

15:55–16:20 Latest SiP Enabling New AI System Integration

Dr. CP Hung

ASE Group

16:20–16:45 High Power Semiconductor Packaging – State of the Art and Development Trends

Dr. Yangang Wang

Dynex Semiconductor, CRRC Times Electric Co., Ltd.

16:45–17:10 Fanout Technology Development in NCAP, China

Dr. Daping Yao

The National Center for Advanced Packaging (NCAP)

17:10–17:35 High Volume Manufacturing of Photonic Devices by Nanoimprint Lithography

Dr. Martin Eibelhuber

EV Group

18:30–20:30 Dinner