Organizing Committee

Chair
David Wei ZHANG Fudan University, China
Liqiang CAO National Center for Advanced Packaging, China
Co-chairs
Lei SHI TongFu Microelectronics Co., Ltd
Ming LI Shanghai Jiaotong University, China
Wenhui ZHU Central South University
Jianhua ZHANG Shanghai University, China
Daoguo YANG Guilin University of Electronic Technology, China
Tim CHEN Yan Tai Darbond Technology Co., Ltd., China
Xiaoyang ZHOU Amkor Technology China
Yufeng JIN PKU, China