Organizing Committee

Chair:

David Wei ZHANG Fudan University, China
Liqiang CAO National Center for Advanced Packaging, China

Co-Chairs:

Lei SHI  TongFu Microelectronics Co., Ltd
Ming LI Shanghai Jiaotong University, China
Jianhua ZHANG Shanghai University, China
Daoguo YANG Guilin University of Electronic Technology, China
Tim CHEN Yan Tai Darbond Technology Co., Ltd., China
Wenhui ZHU Central South University
Xiaoyang ZHOU Amkor Technology China
Yufeng JIN PKU, China