Technical Committee

Chair:

Fei XIAO  Fudan University, China
Lixi Wan  Institute of Microelectronics of the Chinese Academy of Sciences (IMECAS)

Co-Chairs:

Chiming LAI Jiangsu Changjiang Electronics Technology Co., Ltd(JCAP), China
Yifan GUO ASESH/ASE
Sheng LIU Wuhan University
Jian CAI Tsinghua University
Yong LIU Fairchild, USA
Daniel SHI ASTRI, HK, China
Daquan YU Huatian Technology, China
Min MIAO Beijing Information Science & Technology University
Chunqing Wang HIT University, China
Rong SUN SIAT, China
Jintang SHANG Southeast University, China

Secretary:

Wen YIN   Institute of Microelectronics of Chinese Academy of Sciences
Lin CHEN  Fudan University
Jun WANG  Fudan University

 

1 — Advanced  Packaging

Chairs:

Yifan GUO ASESH/ASE Co.,Ltd,China
Jintang SHANG Southeast University,China
Chengqiang CUI Guangdong University of Technology,China

Members:

Kuoning CHIANG National Tsing Hua University,Taiwan
Li LI Cisco Co.,Ltd, USA
Gusung KIM Kangnam University, Korea
Xiaole CUI Peking University,China
Li ZHANG Jiangsu Changjiang Elect.Tech., China
Le LUO Shanghai Institute of Microsystem and Information Technology, China
John XIE FCI Co.,Ltd,USA
XiangMeng JING Hisilicon,China
FengWei DAI National Center for Advanced Packaging Co,Ltd., China

2 — Applied Reliability

Chairs:

Sheng LIU Wuhan University,China
Daoguo YANG Guilin University of Electronic Technology,China
Limin GAO Shanghai Jiao Tong University,China

Members:

Junhui LI Central South University, China
Xueren ZHANG Xilinx Co.,Ltd,USA
Mingxiang CHEN  Huazhong University of Science and Technology, China
Zhengfang QIAN Shenzhen University, China
Yunfei EN CEPREI,China
Jiajie FAN Hohai University,China
Yanfeng ZHANG Huawei Institute,China

3 — Manufacturing, Equipment & Automation

Chairs:

Gilbert ZHOU Amkor Technology,China
YC LEE Nantong Fujitsu Microelectronicsco.,Ltd.
Peijun DING

Members:

SungHwan YANG Amkor Tech.Korea
Guoliang YU Nantong Fujitsu Microelectronicsco.,Ltd.
Hongwei SUN National Center for Advanced Packaging Co,Ltd., China
Teng WANG Tian Shui Huatian Technology Ltd., China
Xiaorong ZHU Shanghai Ncatest Technologies Co.,Ltd,China
K.H. TAN JiangYin  ChangDian Advanced Packaging Co.,Ltd, China
Qian WANG Tsinghua University,China
Ke XIAO Intel China
Tonglong ZHANG Huawei,China
Liang TANG Tangren MicroTelligence Technology Co., Ltd.
Yan LI Intel China
Haiyang GU CETC No.45 Institute,China
Teck Kheng LEE  ITE, Singapore

4 — RF, High-Speed I/O&PI/SI

Chairs:

Lei SHAN IBM, USA
Min MIAO Beijing Electronic Science and Technology Institute

Members:

Yang LIU IBM, USA
Liuling HU ChengDu Ganide Technology CO.,LTD., China
Jiangqi HE Huawei Technologies, USA
Gil AGUIAR NTK Technologies

5– MEMS & Emerging Technology

Chairs:

Daquan YU  Huatian Technology, China
Jing CHEN Peking University, China

Members:

Bin DANG  IBM, USA
Bernd GRUSKA SENTECH Instruments GmbH, Germany
Changhai WANG Heriot-Watt University, UK
Dachao LI Tianjin University, China
Hao TANG  Micro Materials Inc. USA
Luke ENGLANDS   GlobalFoundries, USA
Mingbin YU Shanghai Institute of Microsystem and Information Technology, China
Ning ZHAO Dalian Univerity of Technology, China
Qidong WANG Institute of Microelectronics, Chinese Academy of Sciences, China
Xianping CHEN Chongqing University, China
Yongfeng MEI  Fudan University, China
Yinghui WANG  Institute of Microelectronics, Chinese Academy of Sciences, China
Zheyao WANG Tsinghua University, China, China

6 — Interconnections

Chairs:

Wenhui ZHU Central South University, China
Jian CAI Tsinghua University,China

Members:

Changqing LIU Loughborough University
Robert LO ITRI
Lingzhi CHEN Jiangsu Changjiang Elect.Tech., China
Xin GU Shennan Circuit Co.,Ltd, China
CS TAN Nanyang Technological University, Singapore
Tielin SHI Huazhong University of Science and Technology, China
Zhuo CHEN Central South University, China
Dingyou ZHANG Qualcomm Co.,Ltd,USA
Shenglin MA Xiamen University, China
Charlie LU TSMC,Taiwan
Ning YE  Western Digital,USA
Taekoo LEE  Barun Electronics Co., Ltd

7 — Materials & Processes

Chairs:

Ming LI Shanghai Jiao Tong University, China
Xinfu LIANG JIANGSU CHANGJIANG ELECTRONICS TEC HNOLOGY CO., LTD, China
Rong SUN Shenzhen Institutes of Advanced Technology,CAS,China
Hongbin SHI HUAWEI TECHNOLOGIES CO.,LTD.

Members:

Weiping DOW National Chung Hsing University,Taiwan, China
Yanhong TIAN Harbin Institute of Technology,China
Anming HU Shanghai Jiao Tong University, China
Liangliang LI Tsinghua University,China
Lilei YE Smart High-Tech AB(SHT),Swissa
Su WANG Shanghai Sinyang Semiconductor Materials Co., Ltd., China
Zhuo LI Fudan University,China
Rui GUO Western Digital Corp, China
Fengwen MU The University of Tokyo, Japan
Yan WANG Central South University, China

8 — Modeling & Simulation Thermal/Mech Sim & Char.

Chairs:

Fei QIN  Beijing University of Technology, China
Jiantao ZHENG Qualcomm, USA

Members:

Pei CHEN Beijing University of Technology, China
Hua LU  Greenwich University, UK
Xiaowu ZHANG Institute of Microelectronics (IME)
Haibo FAN Nexperia Hong Kong
Yan ZHANG Shanghai University, China
Xinping ZHANG South China University of Technology, China
Hu HE Central South University, China
Cheng QIAN Beihang University, China
Jue LI Huawei, Finland
Ziyang GAO  Applied Science and Technology Research Institute (ASTRI), HK
Daohui LI  Dynex Semiconductor Ltd, UK

9 — Optoelectronics and Display

Chairs:

Jianhua ZHANG Shanghai University, China
Honglong NIN South China University of Technology

Members:

Moohan SHIN Yongsei University,Korea
Frank SHI University of California, LosANGELS
Yi LUO Dalian University of Technology
Liancheng WANG Central South University
Guoqiao TAO Ampleon Natherlands BV
Chunjian FENG CETC No.45 Institute,China
Haiyun XIE Institute Of Microelectronics Of Chinese Academy Of Sciences
Luqiao YIN Shanghai University
Bo SUN Guangdong University of Technology,China
Wei AO Kunshan Govisionox Optoelectronics Co., Ltd.

10 — Power Electronics

Chairs:

Daniel SHI  Applied Science and Technology Research Institute (ASTRI),HK
Kelvin CHEN HongKong University of Science and Technology(HKUST), HK

Members:

Mark JOHNSON Nottingham Univ,UK
Yuhua CHENG Peking Univ, China
Tianlin REN  Tsinghua Univ, China
Xiaoping DAI  CRRC, China
Winsman NG Tianyu Semi, China
Shunfeng LI Huagong Semi, China
Hongyu YU South University of Science and Technology of China, China
Jefferson HSU GTBF, TW
Huaiyu YE Chongqing Univ, China
Tong AN Beijing Univ of Tech, China
Zhaozhen HOU  Huawei, China
Bin ZHANG ZTE, China
Yunhui MEI  Tianjin Univ., China
Weiwei HE Basic, China
Bin XIE  Applied Science and Technology Research Institute (ASTRI), HK
Ziyang GAO  Applied Science and Technology Research Institute (ASTRI), HK
Fang LUO  Prof. Univ of Arkansas, USA