International Advisory Committees

Shichang ZOU Academician of Chinese Academy of Science (CAS), China

President of Shanghai Integrated Circuit Industry Association, China

Juyan XU Academician of Chinese Academy of Engineering (CAE), China

Honorary Director of No. 58 Institute of China Electronics Technology Group Corporation (CETC), China

Xi WANG Director of Shanghai Institute of Microsystem and Information Technology of Chinese Academy of Sciences
Ke GONG President of Nankai University, China
Dexin WU Institute of Microelectronics of Chinese Academy of Sciences (IMECAS)
Jie XUE Vice president, Cisco Systems Inc., USA
Shijing DIAO Ministry of Industry and Information Technology of the People’s Republic of China
Xiaolan XU Chinese Institute of Electronics
Shouwen YU Prof. of Tsinghua University, China
Jusheng MA Prof. of Tsinghua University, China
Jean TREWHELLA Director of Packaging Technology at GLOBALFOUNDRIES
Rolf ASCHENBERENNER Deputy Director and Head of the Department, Fraunhofer Institute for Reliability and Microintegration Berlin (IZM)
Ricky S. W. LEE Prof. of Hong Kong University of Science and Technology (HKUST), China
William T.CHEN Senior Technical Advisor at ASE Group, USA
C.P. WONG Prof. of Chinese University of Hong Kong, China
Prof. of Georgia Institute of Technology, USA
Rao TUMMALA Pettit Chair Prof. & Director of Packaging Research
Center, Georgia Institute of Technology, USA
Tadatomo SUGA Prof. of The University of Tokyo, Japan