The 18th International Conference on Electronic Packaging Technology (ICEPT 2017) will be held in Harbin in the August 16th-19th, 2017. Researchers around the world are welcome to contibute and attend!
Prospective authors are warmly welcomed to submit abstracts in pdf format to email@example.com.
Deadline for abstract submission extended to April 15.
The relevant conference documents will be found in the page of “Paper Submission-Archives“.