The 2nd ICEPT 2017 Call For Papers

Latest News on 1 Apr , 2017

The 18th International Conference on Electronic Packaging Technology (ICEPT 2017) will be held in Harbin in the August 16th-19th, 2017. Researchers around the world are welcome to contibute and attend!

Prospective authors are warmly welcomed to submit abstracts in pdf format to icept2017@hit.edu.cn.

Deadline for abstract submission extended to April 15.

The relevant conference documents will be found in the page of “Paper Submission-Archives“.