The 19th International Conference on Electronic Packaging Technology (ICEPT) will be held in Shanghai, China, from August 8 to 11, 2018. The ICEPT 2018 is organized by Institute of Microelectronics of Chinese Academy of Sciences (IMECAS), and Fudan University (FDU), and co-organized by National Center for Advanced Packaging Co,.Ltd (NCAP China), and technically sponsored by IEEE Electronics Packaging Society (EPS), Electronics Manufacturing and Packaging Technology (EMPT) Society of Chinese Institute of Electronics (CIE) and China Association for Science and Technology (CAST). ICEPT is one of the flagship conferences of IEEE EPS in China.
ICEPT 2018 is a four-day event, featuring technical sessions, invited talks, professional development courses, exhibition, and social networking activities. It aims to cover the latest technological developments in electronic packaging, manufacturing and packaging equipment, and provide opportunities to explore the trends of research and development, as well as business in China.