CONFERENCE THEMES

  • Advanced Packaging: 2.5 and 3D Packaging; high density interposer and TSV; heterogeneous integration and SiP; advanced substrates and embedded packaging; wafer level, panel level and fan-out packaging; high density flip-chip and advanced CSP; high performance computing and data center applications; R&D on packaging design and process.
  • Applied Reliability: Reliability of TSV, 2.5D, 3D, fan-out, WLCSP, WLFO, PLFO, SiP & MCM; interconnect reliability in flip chip, wire bond and BGA; product reliability including LED, IoT, and automotive; reliability/life test methods & models; failure analysis techniques & materials characterization; drop/dynamic mechanical reliability; system level reliability; automotive & harsh environment reliability; alternative testing vehicles; accelerating testing methods.
  • Manufacturing, Equipment & Automation: Assembly, test, manufacturing, and automation technology for assy & test, process, yield, cost, and productivity improvement, new process and technology, equipment improvement and new equipment, data collection, analysis, and traceability.

  • RF, High-Speed I/O&PI/SI: RF, high-speed I/O & signal/power integrity, electrical modeling, analysis, design, integration, fabrication and characterization of novel devices, packages, and systems for RF/microwave and high-speed I/O. Component optimization and power management of computing/communication systems, smart phones, 5G mobile networking, wearables and bio-electronics, and Internet of Things (IoT), etc.
  • MEMS & Emerging Technology: MEMS, NEMS, sensor, bio-sensor packaging, implantable device packaging, new materials and methods for packaging, microfluidics, MEMS and NEMS, nano-battery. 3D printing, self-alignment and assembly, new packaging process technologies and materials. novel substrates, materials and approaches to interconnects and packaging, packaging for Internet of Things (IoT), wearable electronics, and smart electronics, heterogeneous integration, wafer level integrated silicon photonics.
  • Interconnections: RDL for fan-out and fan-in packaging; chip to wafer/panel and wafer to wafer interconnects, 2.5D/3D interconnects, TSV for heterogeneous integration and SiP, solder bumping and cu pillar; TC bonding, nano-material bonding.
  • Materials & Processes: Materials for packaging, green materials, nano-materials, novel materials for packaging, and packaging/assembly processes for related packaging materials.
  • Thermal/Mechanical Simulation & Charactrization: Thermo-mechanical, moisture, fracture, fatigue, vibration, shock and drop impact modeling and characterization, chip-package interaction, reliability, virtual prototyping, multi-scale modeling and characterization, thermal modeling & characterization, cooling solutions, component, system and product level thermal management and characterization.
  • Optoelectronics and Display: Optoelectronics and solid state lighting design, interconnection, packaging & integration. optoelectronics simulation, packaging and interconnect for micro-display, display module encapsulation & assembly, wearable, bendable, foldable and flexible electronics and display.
  • Power Electronics: Packaging, process and/or materials; thermal management, and advanced interconnection technology for power electronics, substrate technology, IGBT/MOSFET/GaN/SiC module, isolated/non-isolated power converter, inverter module, IPM, POL, PwrSoC, PSiP, open frame, etc., system and product level electrical design, magnetic integration, control algorithm, firmware development, EMI modeling & optimization.