INFO

IMPORTANT DATES

  • March 31, 2017    April 15, 2017    Deadline for Submission of Abstract
  • April 30, 2017                      Notification of Abstract Acceptance
  • May 31, 2017    June 14, 2017          Deadline for Submission of Full Paper
  • July 10, 2017   July 10, 2017        Notification of Full Paper Acceptance
  • July 15, 2017                      Deadline of Final Paper Submission

SUBMISSION OF FULL PAPER

Click here to download the full paper  template.

Please read carefully the reviewers’ comments and prepare the full version of your paper taking them into due consideration. Please strictly follow the format of full paper template to finish your full paper and submit it in PDF version through “Easy Chair” system (https://easychair.org/conferences/?conf=icept2017) by June 14, 2017. DO NOT submit your full paper by Email. Note that full paper template can be downloaded from conference website. Instructions for electronic submission for preparation of the full paper are available at http://www.icept.org/. Please consult this website for further updates about the conference.

Accepted papers are limited to six (6) pages. However, if your manuscript consists of more (up to eight) pages in length, each page above the limit of six pages would require a pre-payment of an over length fee.

The instructions for paper submission can be downloaded at the conference website http://www.icept.org. All accepted papers will be indexed by IEEE Xplore. Selected papers will be recommended for publication in related IEEE/CPMT journals.

BEST PAPER AWARD

The conference proceeding is an official IEEE publication. Best Conference and Student Papers will be selected and awarded at the conference.

CALL FOR SHORT COURSES

The conference program includes professional development courses (PDC), and the leading experts in the field may e-mail to icept2017@hit.edu.cn for details.

CALL FOR EXHIBITION/SPONSORSHIP

A tabletop exhibition featuring suppliers of materials, equipment, components, software, manufacturers, and service providers of the electronics packaging and related industries will be held during the conference. Potential exhibitors and sponsors may e-mail to icept2017@hit.edu.cn for details.

Conference Website: http://www.icept.org/en

Conference E-mail: icept2017@hit.edu.cn