INFO

IMPORTANT DATES

April  16, 2018  Deadline for Submission of Abstract

April 30, 2018  Notification of Abstract Acceptance

June 19, 2018 Deadline for Submission of Full Paper

July 09, 2018  Notification of Full Paper Acceptance

July   16, 2018  Deadline of Final Paper Submission

Please submit the full paper both in PDF and MS-Word formats.

a7c0c1d5td1167c1f2ecf&690

u=3864060106,1781024052&fm=200&gp=0

SUBMISSION OF FULL PAPER

Click here to download the full paper  template. Please  submit your paper in PDF version through Easy Chairby May 28, 2018. DO NOT submit your full paper by Email.

Note that full paper template can be downloaded from conference website. Instructions for electronic submission for preparation of the full paper are available at http://www.icept.org/. Please consult this website for further updates about the conference.

Accepted papers are limited to six (6) pages. However, if your manuscript consists of more (up to eight) pages in length, each page above the limit of six pages would require a pre-payment of an over length fee.

The instructions for paper submission can be downloaded at the conference website http://www.icept.org. All accepted papers will be indexed by IEEE Xplore. Selected papers will be recommended for publication in related IEEE/CPMT journals.

BEST PAPER AWARD

Best Conference and Student Papers will be selected and awarded at the conference.

CALL FOR EXHIBITION/SPONSORSHIP

A tabletop exhibition featuring suppliers of materials, equipment, components, software, manufacturers, and service providers of the electronics packaging and related industries will be held during the conference. Potential exhibitors and sponsors may e-mail to icept@fudan.edu.cn for details.

Conference Website: http://www.icept.org/en

Conference E-mail: icept@fudan.edu.cn