The 18th International Conference on Electronic Packaging Technology (ICEPT2017) will be held in Harbin, China, from August 16 to 19, 2017. The ICEPT 2017 is organized by Chinese Institute of Electronics (CIE), Institute of Microelectronics of Chinese Academy of Sciences (IMECAS), IEEE-CPMT, Electronic Manufacturing and Packaging Technology Society of Chinese Institute of Electronics (CIE-EMPT) and co-organized by Harbin Institute of Technology (HIT). As one of the most famous international conferences on electronic packaging technology, the conference has received strong support from IEEE CPMT and active involvement from IMAPS and iNEMI, and was highly appreciated by CIE and China Association for Science and Technology (CAST).
ICEPT 2017 is a four-day event, featuring technical sessions, invited talks, professional development courses, exhibition, and social networking activities. It aims to cover the latest technological developments in electronic packaging, manufacturing and packaging equipment, and provide opportunities to explore the trends of research and development, as well as business in China.