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ICEPT2016 Paper List

About ICEPT

About ICEPT

Inaugurated in 1994, the International Conference on Electronic Packaging Technology (ICEPT), hosted by the Chinese Institute of Electronics (CIE) and organized by the Electronic Manufacturing and Packaging Technology Society (EMPT) of CIE as well as several participating universities, has been successfully held 15 times in Beijing, Shanghai, Shenzhen, Xi’an, Guilin, Dalian and Chengdu. ICEPT offers attendees, including experts, researchers and engineers from industry and academia, numerous opportunities for discussion on state-of-the-art technologies in electronic packaging. The Chinese semiconductor industry was initiated by the “12-Year Plan for Scientific and Technological Development” in 1956. With more than 50 years of progress, China has formed a complete industry chain incorporating all three sectors of the semiconduc...

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Schedules for ICEPT 2016
25 Jul 2016

Schedules for ICEPT 2016

Please click on the following links to download the new attached files. 【 Program Flyer】 【 Shedu...
Template for ICEPT 2016 Presentation and Poster
14 Jul 2016

Template for ICEPT 2016 Presentation and Poster

Please click on the following links to download! 【Template for Presentation】      【 Template for ...
Notice of  the filing date of the IEEE Copyright and Consent Form
1 Jul 2016

Notice of the filing date of the IEEE Copyright and Consent Form

Dear authors, We are writing to inform you that the filing date of  the IEEE Copyright and Consen...
Extension notice of  the date of Abstract receive notification
30 Apr 2016

Extension notice of the date of Abstract receive notification

Extension notice Dear authors, We are writing to inform you that the date of ICEPT 2016 Abstract...

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