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18th International Conference on Electronic Packaging Technology (ICEPT 2017)

The 18th International Conference on Electronic Packaging Technology (ICEPT2017) will be held in Harbin, China, from August 16 to 19, 2017. The ICEPT 2017 is organized by Chinese Institute of Electronics (CIE), Institute of Microelectronics of Chinese Academy of Sciences (IMECAS), IEEE-CPMT, Electronic Manufacturing and Packaging Technology Society of Chinese Institute of Electronics (CIE-EMPT) and co-organized by Harbin Institute of Technology (HIT). As one of the most famous international conferences on electronic packaging technology, the conference has received strong support from IEEE CPMT and active involvement from IMAPS and iNEMI, and was highly appreciated by CIE and China Association for Science and Technology (CAST). ICEPT 2017 is a four-day event, featuring technical sessions, invited talks, professional developme...

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Final Program
4 Aug 2017

Final Program

Please download ICEPT2017 final Program!
Conference Program Updated!
2 Aug 2017

Conference Program Updated!

We have updated the information about Program, Plenary Talks and Professional Development Courses!
About Registration
11 Jul 2017

About Registration

Please fill in the Registration Form and send back to both market@cepem.com.cn andicept2017@hit.edu....
Useful Information Updated!
6 Jul 2017

Useful Information Updated!

We have updated the information about Hotels! Find more here!

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