学术委员会

Name Organization
Chair Chengqiang CUI Prof. of Guangdong University of Technology, China
Liqiang CAO Prof. of Institute of Microelectronics of Chinese Academy of Sciences, China
Co-Chairs Chiming LAI Vice President of Jiangsu Changjiang Electronics Technology Co., Ltd (JCAP), China
Fei XIAO Prof. of Fudan University, China
Sheng LIU Prof. of Wuhan University , China
Jian CAI Prof. of Tsinghua University, China
Yong LIU Chief engineer of Fairchild, USA
Yanhong TIAN Prof. of Harbin Institute of Technology, China
Rong SUN Prof. of Shenzhen Institutes of Advanced Technology, CAS, China
Fei QIN Prof. of Beijing University of Technology, China
Daquan YU CTO of Hua Tian Technology ,China
Daoguo YANG Prof. of Guilin University of Electronic Technology, China
Ming LI Prof. of Shanghai Jiao Tong University, China
Daniel SHI Senior Director of ASTRI, HK, China
Secretary Yu ZHANG A/Prof. of Guangdong University of Technology, China
Bo SUN A/Prof. of Guangdong University of Technology, China
1 — Advanced Packaging
Chairs Li ZHANG JCET, Shaoxing, China
Jintang SHANG Southeast University,China
Qian WANG Tsinghua University, China
Members Hao TANG Micro Materials Inc., USA
Teng WANG MIXOSENSE
Junghyunn CHAE TFME
Zirong TANG HUST, China
JunqiANG WANG North University of China, China
Yan WANG Central South University, China
Yinghui WANG IME, CAS, China
Pengli ZHU Shenzhen institute of advanced technology, CAS, China
Sha XU Guangdong University of Technology, China
2 Packaging Materials & Processes
Chairs Tao HANG Shanghai Jiao Tong University, China
Yu ZHANG Guangdong University of Technology, China
Members Liangliang LI Tsinghua University, China
Zhuo LI Fudan University, China
Yanhong TIAN Harbin Institute of Technology, China
Mingliang HUANG Dalian University of Technology, China
Guoping ZHANG Shenzhen institute of advanced technology, CAS, China
Fengwen MU Institute of Microelectronics, CAS, China
Cong ZHANG Western Digital
Su WANG Shanghai Sinyang Semiconductor Materials Co., Ltd., China
Wei TAN Jiangsu HHCK Advanced Materials Co., Ltd., China
3 Packaging Design & Modeling
Chairs Daoguo YANG Guilin University of Electronic Technology, China
Tonglong ZHANG Huawei, China
Members Jiantao ZHENG Hisilicon, China
Pei CHEN Beijing University of Technology, China
Hua LU Greenwich University, UK
Xiaowu ZHANG Institute of Microelectronics (IME), China
Haibo FAN Nexperia Hong Kong, China
Xinping ZHANG South China University of Technology, China
Hu HE Central South University, China
Cheng QIAN Beihang University, China
Jue LI Huawei, Finland
Daohui LI Dynex Semiconductor Ltd, UK
Xu LONG Northwestern Polytechnical University, China
Hongbo QING Guilin University of Electronic Technology, China
4 Interconnection Technologies
Chairs Jian CAI Tsinghua University,China
Kelvin PUN Compass Technology Company Ltd.,China
Members Lingzhi CHEN Jiangsu Changjiang Elect.Tech., China
Zhuo CHEN Central South University, China
Xin GU Shennan Circuit Co.,Ltd, China
Hao LIU Ramaxel, China
Yingxia LIU Beijing Institute of Technology, China
Ziyu LIU Fudan University, China
Shenglin MA Xiamen University, China
Shuying MA Huatian Technology (Kunshan) Electronics Co., Ltd,China
CS TAN National Technology University, Singapore
Chenxi WANG Harbin Institute of Technology, China
Chaoqi ZHANG Qualcomm Inc., USA
Dingyou ZHANG Broadcom Inc. ,USA
5 Advanced Manufacturing & Packaging Equipment
Chairs Sheng LIU Wuhan University, China
Yi SONG Wuhan University, China
Members Jinrong Zhao NAURA Technology Group Co., Ltd.
Zhiyin GAN Huazhong University of Science and Technology, China
Daquan YU Xiamen University, China
Shuying MA Huatian Technology(Kunshan) Co.,Ltd
Hongjie WANG TF – AMD
Fulong ZHU Huazhong University of Science and Technology, China
Haitao SHI JCET Group Co., Ltd.
Xinjun ZHOU InnoLight Technology (Suzhou)
6 Quality & Reliability
Chairs Bin XIE Hong Kong Applied Science and Technology Research Institute, China
Jian GAO Guangdong University of Technology, China
Huaiyu YE Shenzhen Institute of Wide-Bandgap Semiconductors, China
Members Bin LIU Intel Asia-Pacific Research & Development Ltd.
Weiqiang LI Huawei Technologies Co., Ltd., China
Jianli ZHANG BYD Company Limited, China
Andy DAI Coresing Semiconductor Technology Co.Ltd
Zhiwen CHEN Wuhan University, China
Ke XUE Southern University of Science and Technology, China
Yunfei EN The Fifth Institute of MIIT, China
Wayne LIN Shenzhen Institute of Wide-Bandgap Semiconductors, China
Puqi NING Institute of Electrical Engineering, CAS, China
Miao CAI Guilin University of Electronic Technology, China
7 Power Electronics
Chairs Ziyang GAO Applied Science and Technology Research Institute (ASTRI), HK, China
Bo SUN Guangdong University of Technology, China
Members Yuhua CHENG Peking University, China
Qinsong QIAN Southeast University, China
Shunfeng LI Huagong Semi, China
Hongyu YU South University of Science and Technology, China
Jefferson HSU Great Team Backend Foundry, Inc., China
Zhaozhen HOU Huawei, China
Bin ZHANG ZTE, China
Yunhui MEI Tianjin University, China
Weiwei HE Basic, China
River LI Applied Science and Technology Research Institute (ASTRI), HK, China
Joyce WANG EPC Corporation, USA
Jimmy LIU GaN Systems, Canada
8 Optoelectronics and New Display
Chairs Fengman LIU Institute of Microelectronics, CAS, China
Hongbin CHEN Cedar Electronics
Members Zhaojun LIU Sustc University, Korea
Yu SUN National Center for Advanced Packaging (NCAP), China
Yi LUO Dalian University of Technology, China
Liancheng WANG Central South University, China
Guoqiao TAO Ampleon, Netherlands
Jifang TAO Shangdong University, China
Haiyun XUE Institute of Microelectronics, CAS, China
Yaming FAN Sinano
Ping CHEN Institute of Microelectronics, CAS, China
9 MEMS&Fan-out Packaging
Chairs Tingyu LIN Guangdong Fozhixin, China
Alex YU Shanghai Micro-system Institute
Daping YAO Zhongke Zhixin, China
Members Goujun HU Smart Drive Sensing (wuxi) Co. Ltd., China
Fengwei DAI National Center for Advanced Packaging (NCAP), China
Fengze HOU Delft University of Technology, Netherland
Yue SUN Shenzhen institute of wide-bandgap semiconductors(iWins), China
Feng JIANG Xiamen Sky Semiconductor Technology Co.Ltd. , China
Tim CHEN Debang Material Co., Ltd
Farhang YAZDANI Broadpak Co.Ltd, USA
Braun TANJA IZM.fraunhofer, German
Thorsten MEYER Infineon Co., Ltd, German
Xuyuan SUN National Center for Advanced Packaging (NCAP), China
Hengyun ZHANG Shanghai University of Engineering and Technology, China
Guochi HUANG Fujian Normal University
Tong CUI C&BTECH Technologies Co.,Ltd, USA
Fujiwara SAN JSR (Japan) Co. Ltd, Japan
10 Emerging Technologies
Chairs Yan ZHANG Shanghai University, China
Guannan YANG Guangdong University of Technology, China
Members Jun WANG Fudan University, China
Gaowei XU Shanghai Institute of Microsystem & Information Technology, CAS, China
Xiuzhen LU Shanghai University, China
Jun ZHANG Guangdong University of Technology, China
Hongbin SHI Huawei Technologies Co., Ltd., China
Hongwen HE Hisilicon Technologies Co., Ltd., China
Shuhui YU Shenzhen institute of advanced technology, CAS, China
Hui TANG Guangdong University of Technology, China
Xun HUAN Guangdong Fozhixin, China