- PDC-1: The Status and Prospect of Ag and Cu Sintering Paste Bonding Technology
Dr. Ning-Cheng Lee (Online)
- PDC-2: Failure Analysis in Semiconductor Packaging Assembly Process
Dr. Yifan Guo (Online)
- PDC-3: Progress of Advanced 3D Wafer Level Packaging: 2.5 Interposer, 3D IC and High- Density Fan-Out Technology
Prof. Daquan Yu
- PDC-4: Co-Design and Manufacturing – Nano Electronic Packaging and Optoelectronic Packaging
Prof. Sheng Liu
- PDC-5: Design of the 3rd Generation Semiconductor-Based Power Electronics Solutions for Smart City Applications
Dr. Ziyang GAO (Online)
- PDC-6: Emerging Power Packaging Technology and Process
Dr. Carlos Chow (Online)
- SIAT Session: Advanced Electronic Packaging Materials Research and Application
Prof. Rong Sun
