Synthesis and Performance of Silver and Copper Nanomaterials for Advanced Electronic Packaging Xi Wu, Shenzhen Institutes of Advanced Technology, CAS
Novel Micro-LED Display and Its Applications Zhaojun Liu, Southern University of Science and Technology
PLP Solutions for HVM of 3D Integrated Systems Tanja Braun (Online), IZM Frauhold, Germany
Thermal Modeling and Design of 3D Memory Stack on Processor with Thermal Bridge Structure Hengyun Zhang, Shanghai University of Engineering Science
Research Methods on Wafer Backside Grinding Pei Chen, Beijing University of Technology
Application of Temporary Bonding / Debonding Technology in Advanced Packaging Guoping Zhang, Shenzhen Institute of advanced Technology, CAS
Overview of Fan-In and Fan-Out Wafer Level Packaging (WLP) Development Daping Yao, National Center for Advanced Packaging Co., Ltd
2.5D Packaging for 4×56Gbps PAM4 Optical Module Using Silicon Interposer Yu SUN, IME, CAS
The Technology and Challenging of PLP for 3D Packaging Forllin Tan, SMAT
Progress and Applications of Panel Level Packaging Xun Huan, Fozhixin Microelectronics Technology Researh Co., Ltd
Multiphysics Design in Power Electronics Packaging Daohui Li (Online), Dynex Semiconductor Ltd
Electrodeposited Micro/Nano Cone Arrays Applied in Low Temperature Bonding for High Density 3D Packaging Yunwen Wu, Shanghai Jiao Tong University
Advanced Packaging Technology for SiC Power Device Jing Zhang, Heraeus Shanghai
Wafer-Level Micro-Scale Precision Manufacturing for Advanced System Packaging Daquan Yu, Xiamen University, Xiamen Sky Semiconductor Co., Ltd
Analysis of Heat Dissipation Characteristics of Three-Dimensional Graphene-Carbon Nanotube Composite Structures Yan Zhang, Shanghai University.
Research on The Topology and Control Strategy of A High Frequency & High Efficiency Converter for The Isolated DC-DC Power Supplies Qinsong Qian, Southeast University
Advanced interconnects to enable integration and manufacture of power electronics with wide-band gap (WBG) devices Changqing Liu (online), Loughborough University
Development of New Low Dk/Df Material for 5G Application Masaaki Saito, JSR
Microsystem Reliability and Application Research Yunfei En, The 5th Institute of Electronics of MIIT
How to Make Packaging Equipment Faster and More Accurate Yunbo He, Ada
Warpage Simulation, Experimental Verification and Optimization Analysis for the Panel-Level Fan-Out Packaging Fengze Hou (Online), Delft University of Technology
