Meeting Details


August 11~14, 2021,Xiamen,China

1st Call for Papers

2021 22nd International Conference on Electronic Packaging Technology (ICEPT) will be held in Xiamen, China, from August 11 to 14, 2021. The ICEPT 2021 is hosted by Xiamen University and Institute of Microelectronics of Chinese Academy of Sciences (IMECAS), organized by School of Electronic Science and Engineering of Xiamen University, Xiamen Semiconductor Investment Group Co., Ltd. and Beijing Faith Information Consultant Ltd. As one of the most famous international conferences on electronic packaging technology, the conference has received strong support from IEEE- EPS and high praise from Chinese Institute of Electronics (CIE) and China Association for Science and Technology (CAST). At present, Moore's Law has reached an inflection point, semiconductor manufacturing technology is facing challenges, and new packaging technologies are constantly emerging. This conference will provide an academic communication platform for new progresses and new ideas in electronic packaging and manufacturing technology for experts, scholars and researchers from academia and industry worldwide.

During the four-day event, participants from many countries and regions will share the latest technological developments of electronic packaging technologies via special lectures, invited talks, theme forums, technical sessions, exhibitions, poster presentations and other forms. We sincerely invite you to join in this event!


 Advanced Packaging: 2.5D and 3D packaging, wafer-level and panel-level packaging, flip chip, Fan-Out, system integration, heterogeneous/hybrid integration.

  Packaging Materials & Processes: New packaging materials, advanced packaging substrate, green materials, nano-materials, and related packaging materials for packaging/assembly processes.

  Packaging Design & Modeling: Design, modeling, methodology, and simulation for system integration and packaging; methodology and simulation for electrical/thermal/optical/mechanical models, multi-scale and multi-physics modeling, process simulation.

  Interconnection Technologies: TSV, bumping and micro copper pillar technologies, high density inter-connection technologies, nano-materials bonding technologies, interposer, redistribution layer technologies for fan-in and fan-out packaging, chip-to-wafer/panel and wafer-to-wafer interconnect technologies, thermocompression bonding, non-conventional inter-connection technologies..

  Advanced Manufacturing: Assembly, testing, manufacturing, automation technologies and equipment for Packaging manufacturing.

  Quality & Reliability: Test technologies for packaging, quality monitoring and evaluation, methodologies for reliability data collection and analysis, reliability modeling, life prediction, failure analysis and non-destructive diagnose. 

  Power Electronics: Thermal management, interconnection and substrate technologies for power electronics, switch module, isolated/non-isolated power converter, inverter module, IPM, POL, PwrSoC, PSiP, open frame, electrical design, magnetic integration, control algorithm, firmware development, EMI modeling & optimization.

 Optoelectronics and New Display: Optoelectronics and solid state lighting design, simulation, interconnection, packaging & integration, display module encapsulation & assembly, new display device and module encapsulation & assembly, mass Transfer of MicroLED, wearable, bendable, foldable and flexible electronics and display. 

  MEMS, Sensors and IoT: MEMS, NEMS, sensor, sensor packaging, implantable device packaging, microfluidics, nano-battery. 3D printing, self-alignment and assembly, wafer-level and panel-level packaging, redistribution layer, reliability, new structure and technologies for fan-out packaging. 

 Emerging Technologies: Electrical modeling, analysis, design, integration, fabrication and characterization of novel devices, packages, and systems for RF/microwave and high-speed I/O, component optimization and power management of computing/communication systems, 5G mobile networking, wearable/flexible electronics and bio-electronics, etc.


  April 10, 2021    Deadline for Submission of Abstract

  April 30, 2021      Notification of Abstract Acceptance

  May 30, 2021       Deadline for Submission of Full Paper

■  June 30, 2021      Notification of Full Paper Acceptance


Abstracts are solicited to describe original and unpublished work. The abstract should be approx. 500 words and contains a clear statement of the background, methodology, results, and conclusions. All abstracts and manuscripts must be in English and should be submitted through online submission system. The instructions for abstract submission can be found at the conference website All accepted manuscripts will be submitted for inclusion into IEEE Xplore. Selected papers will be recommended for publication in related IEEE/EPS journals.


Best Papers and Posters will be selected and awarded at the conference.


A tabletop exhibition featuring suppliers of materials, equipment, components, software, manufacturers, and service providers of the electronics packaging and related industries will be held during the conference. Potential exhibitors and sponsors may e-mail to for details.

General   Chair:          Professor Tianchun YE 

Executive  Chair:        Professor Rong ZHANG

Organizing Chair:      Professor Zhong CHEN     

Technical  Chair:        Professor Daquan YU         

Conference Website:   E-mail: 



As one of China’s five special economic zones, Xiamen was once called “Ludao”, meaning Egret Island, due to many birds used to inhabit the area. Now it is the second largest city in Fujian province, covering a total area of 1,516 square kilometers. The city has seen rapid growth in economic and social development in recent years, with large amounts of investment from Taiwan, Hong Kong and foreign countries. Despite its fame as an industrial powerhouse, this port city still maintains its charm with traditional architecture, delicious food, a pleasant climate and picturesque scenery, attracting many visitors every year.


Xiamen University (XMU), established in 1921 by renowned patriotic overseas Chinese leader Mr. Tan Kah Kee, is the first university founded by an overseas Chinese in the history of modern Chinese education. XMU has long been listed among China’s leading universities on the national 211 Project, 985 Project and Double First-class initiative, which have been launched by the Chinese government to support selected universities in achieving world-class standing.