大会组织

Honorary Chair
Keyun BI Honorary President of Electronic Manufacturing and Packaging Technology Society (EMPT), CIE, China

Standing Director of the Committee, CIE, China

Vice President China Semiconductor Industry Association (CSIA), China

General Chair
Tianchun YE Director of Institute of Microelectronics of Institute of Microelectronics of Chinese Academy of Sciences (IMECAS), China

Vice President China Semiconductor Industry Association (CSIA), China

Director of R&D Center for Internet of Things, Chinese Academy of Science

Executive Chair
Ningsheng XU President of Fudan University
Co-chairs
Avram Bar-Cohen President of IEEE EPS (2018-2019)

Principal Engineering Fellow at Raytheon Corporation, USA

Kouchi ZHANG Prof. of Delft University of Technology, Netherlands
Johan LIU Prof. of Chalmers Univ. of Science & Technology, Sweden

Prof. of Shanghai University, China

Member of Royal Swedish Academy of Engineering, Sweden

Xuejun FAN Prof. of Lamar University, USA
Secretary
Wen YIN Institute of Microelectronics of Chinese Academy of Sciences
Lin CHEN Fudan University, China
Jun WANG Fudan University, China
Wenjie YU Shanghai Institute of Microsystem and Information Technology of Chinese Academy of Sciences
Hao ZHU Fudan University, China