国际咨询委员会

Shichang ZOU Academician of CAS
President of Shanghai Integrated Circuit Industry Association, China
Juyan XU Academician of CAE, Honorary Director of No. 58 Institute of CETC, China
Xi WANG Director of Shanghai Institute of Microsystem and Information Technology Chinese Academy of Sciences
Ke GONG President of Nankai University, China
Dexin Wu  Institute of Microelectronics of the Chinese Academy of Sciences (IMECAS)
Jie XUE Director, Cisco Systems Inc., USA
Shijing DIAO Ministry of Industry and Information Technology of the People’s Republic of China
Xiaolan XU Chinese Institute of Electronics
Shouwen YU Former Vice President of Tsinghua University, China
Jusheng MA Prof. of Tsinghua University, China
Jean TREWHELLA Jr. Past President of IEEE-EPS, Director of Packaging Technology at GLOBALFOUNDRIES
Rolf ASCHENBERENNER Deputy Director and Head of Department bei Fraunhofer IZM
Ricky S. W. LEE Prof. of HKUST, Hong Kong, China
President of IEEE-CPMT, USA
William T.CHEN Former President of IEEE-CPMT
Senior Director of ASE, USA
C.P. WONG CUHK, Hong Kong, China
Georgia Institute of Technology, USA
Rao TUMMALA Pettit Chair Prof. & Director of Packaging Research
Center, Georgia Institute of Technology, USA
Tadatomo SUGA Prof. of University of Tokyo, Japan