Conference Topics

  • Advanced Packaging: 2.5D and 3D packaging, wafer-level and panel-level packaging, flip chip, advanced packaging substrate technologies, system integration, heterogeneous/ hybrid integration, packaging design and process.
  • Packaging Materials & Processes: New packaging materials, green materials, nano-materials, and related packaging materials for packaging/assembly processes.
  • Packaging Design & Modeling: Design, modeling, methodology, and simulation for system integration and packaging; methodology and simulation for electrical/ thermal/ optical/ mechanical models, multi-scale and multi-physics modeling, process simulation.
  • Interconnection Technologies: TSV, bumping and micro copper pillar technologies, high density inter-connection technologies, nano-materials bonding technologies, interposer, redistribution layer technologies for fan-in and fan-out packaging, chip-to-wafer/panel and wafer-to-wafer interconnect technologies, thermocompression bonding, non-conventional inter-connection technologies.
  • Advanced Manufacturing & Packaging Equipment: Assembly, testing, manufacturing, automation technologies and equipment for Packaging manufacturing.
  • Quality & Reliability: Test technologies for packaging, quality monitoring and evaluation, methodologies for reliability data collection and analysis, reliability modeling, life prediction, failure analysis and non-destructive diagnose.
  • Power Electronics: Thermal management, interconnection and substrate technologies for power electronics, switch module, isolated/non-isolated power converter, inverter module, IPM, POL, PwrSoC, PSiP, open frame, electrical design, magnetic integration, control algorithm, firmware development, EMI modeling & optimization.
  • Optoelectronics and New Display: Optoelectronics and solid state lighting design, simulation, interconnection, packaging & integration, display module encapsulation & assembly, new display device and module encapsulation & assembly, mass Transfer of MicroLED, wearable, bendable, foldable and flexible electronics and display.
  • MEMS & Fan-Out Packaging: MEMS, NEMS, sensor, sensor packaging, implantable device packaging, microfluidics, nano-battery. 3D printing, self-alignment and assembly, wafer-level and panel-level packaging, redistribution layer, reliability, new structure and technologies for fan-out packaging.
  • Emerging Technologies: Electrical modeling, analysis, design, integration, fabrication and characterization of novel devices, packages, and systems for RF/microwave and high-speed I/O, component optimization and power management of computing/ communication systems, 5G mobile networking, wearable/flexible electronics and bio-electronics, etc.