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Monthly ArchiveJanuary 2018

ICEPT 2019 CALL FOR PAPERS

ICEPT 2019 CFP

The International Conference on Electronic Packaging Technology (ICEPT) will reach its 20th anniversary in 2019. To highlight this milestone, it was decided ICEPT 2019 will be held outside mainland China for the first time. The venue of ICEPT 2019 will be at the Hong Kong Science Park, Shatin, Hong Kong, China, and the conference will be held on 11th -15th August 2019. ICEPT 2019 is organized by the Institute of Microelectronics of Chinese Academy of Sciences (IMECAS). This event is also co-organized by Hong Kong Science and Technology Parks (HKSTP) Corporation. ICEPT 2019 is an international event, featuring plenary talks, oral and poster technical sessions, professional development courses, exhibitions, and social networking activities. It aims to cover the latest development of packaging and manufacturing technologies for ICs, optoelectronics, passives, and MEMS. The ICEPT series is one of the flagship events of IEEE Electronics Packaging Society (EPS). ICEPT 2019 is technically sponsored by IEEE EPS. 

Important Date

  • 15th April, 2019: Deadline for Abstract Submission
  • 30th April, 2019:   Deadline for Abstract Submission
  • 29th April, 2019: Notification of Abstract Acceptance
  • 7th May, 2019:   Notification of Abstract Acceptance
  • 17th May, 2019:   Notification of Abstract Acceptance
  • 27th May, 2019: Deadline for Full Paper Submission
  • 10th June, 2019:   Deadline for Full Paper Submission
  • 24th June, 2019: Notification of Full Paper Acceptance
  • 15th July, 2019: Deadline of Final Paper Submission