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Organizing Committee

 

Secretary General
Ronnie Qing LI EMPT, CIE, China
Yuanyuan ZUO Xidian University, China
Organizing Committee
Chair
Yiqi ZHUANG Xidian University, China
Co Chairs
Changchun CHAI Xidian Univerity, China
Kewei XU  Science and Technology Bureau of Xi’an, China
Xiaoning HE Xi’an IC Design Base, China
Xiang WU CETC, China
Lixi WAN Institute of Microelectronics, CAS, China
Chiming LAI Jiangyin Changdian Advanced Packaging Co., Ltd, China
Ming LI Shanghai JiaoTong University, China
Chunqing WANG Harbin Institute of Technology, China
Yiping WU Huazhong University of Science and Technology, China
Fei XIAO Fudan University, China
Hong WANG Xi’an JiaoTong University, China
Louis LIU Grand Technology(Shenzhen) Co., Ltd, China
Xingsheng LIU Xi’an Institute of Optics and Precision Mechanics, CAS, China
Members
Xingzao HUANG Beijing Faith Consulting Co., Ltd, China
Zhen LI EMPT, CIE, China
   
   
   
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Electronic Manufacturing and Packaging Technology Society of Chinese Institute of Electronics (CIE-EMPT)
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