| Chair | |||
| Xuejun FAN | Lamar University, USA | ||
| Co-Chairs | |||
| Jian CAI | Tsinghua University，China | ||
| Jianyuan JIA | Xidian University，China | ||
| Gang DONG | Xidian University，China | ||
| Wenhui ZHU | UTAC, Singapore | ||
| Daniel SHI | ASTRI, Hong Kong，China | ||
| Jianhua ZHANG | Shanghai University，China | ||
| Professional Development Courses | |||
| Chair | |||
| Wenhui ZHU | UTAC, Singapore | ||
| Co-chair | |||
| Yuejin LI | Xidian University, China | ||
| Sessions and Chairs | |||
| Advanced Packaging & System Integration | |||
| High Density Substrate & SMT | |||
| Packaging Design & Modeling | |||
| Emerging Technologies | |||
| Packaging Materials & Processes | |||
| Advanced Manufacturing & Packaging Equipment | |||
| Quality & Reliability | |||
| Solid State Lighting (SSL) Packaging and Integration | |||
| Poster | |||
| HOME | |||