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Dr. Siegfried Görlich is currently with Infineon Technologies, Germany, working as head of central failure analysis lab. He is involved in design debug, product ramp-up support, latest process development lab support and customer support. He has been with Siemens Central Research and Siemens Semiconductor Group being now Infineon Technologies Germany since 1985. In his 30 years of semiconductor experience, he authored or co-authored more than 100 publications in the field of analytics or failure analysis. Dr. Siegfried Görlich earned a Diploma degree in Physics and a Ph.D. in Electrical Engineering both from the Duisburg University,Germany.

 

Mr. Xue Ming obtained a degree in radio technology, JaoTong University, Xi An in 1982. He started work in Navigational Aids International, Shanghai in 1982, where he worked 10 years as a product designer / project manager for products in radio receiver, radio transmitter, and wireless remote control system of navigational aids signal. In 1992, he joined Seagate technology international Singapore as a product engineer, and worked 4 years in PCBA process and FA lab. In 1995, he joined Siemens Component, now, Infineon Technologies Singapore as Senior FA engineer. Currently, he is senior manager of the failure analysis lab. In his 15 years semiconductor backend experience, his job involves IC chip and package failure analysis, package reliability characterization, process quality risk management, qualification, customer return and printed circuit board assembly support.

 

Dr. Ricky Lee received his PhD degree from Purdue University in 1992. Currently he is Professor of Mechanical Engineering and Director of Center for Advanced Microsystems Packaging at the Hong Kong University of Science & Technology (HKUST). He also serves as Director of HKUST Shenzhen Electronic Materials & Packaging Laboratory. Ricky's research activities cover flip chip technologies and wafer level packaging, through silicon vias and 3D packaging, passive alignment of optical fibers and LED packaging, lead-free soldering and solder joint reliability, computational modeling and stress analysis. He has substantial publications in international journals and conference proceedings. He also co-authored three books (two have been translated into Chinese) and owned several patents. Ricky is very active in international professional societies and has been appointed several leadership positions. He is Fellow of IEEE, ASME, and Institute of Physics. He is also elected IEEE CPMT Distinguished Lecturer and has been giving seminars and workshops worldwide. In addition, Ricky serves as Editor-in-Chief of IEEE Transactions on Components & Packaging Technologies. Due to his contributions in R&D on electronic packaging and assembly, Ricky won IEEE CPMT Electronics Manufacturing Technology Award and ASME EPPD Applied Mechanics Award.

Dr. Hong Meng HO obtained a degree in Mechanical Engineering in 1989 and a PhD in Mechanical Engineering in 1994, both from the University of Manchester Institute of Science & Technology (UMIST). In 1996, he joined IME, Singapore, as a R&D engineer and then joined Delphi Automotive System Singapore as a senior engineer in 1998. In 2001, he joined IMEC, Belgium, as the Assembly Technology Section Leader, where he started to work on copper wire bonding. In 2003, he joined Kulicke & Soffa Singapore Ball Bonder Division as a staff engineer, responsible for the process development of copper wire bonding. In 2006, he transferred to the K&S Bonding Wire Division as a principal engineer, responsible for the development of new copper wires. Since then, he had developed two new copper wire products that were launched in 2007 and 2008 respectively. In 2009, he joined AceStrella as a consultant and had been conducting workshops on “Advanced Wire Bonding for Semiconductor Manufacturing” in both Malaysia and Thailand. Currently, he is technical director in Semicon Fine Wire Pte Ltd, responsible for the overall research and development of copper bonding wire.

Prof. C. P. Wongis a Regents’ Professor and holder of the Charles Smithgall Institute Endowed Chair (one of the two Institute Endowed Chairs at GT) at the School of Materials Science and Engineering at Georgia Institute of technology. He received his B.S. degree from Purdue University, and his Ph.D. degree from the Pennsylvania State University. After his doctoral study, he was awarded a two-year postdoctoral fellowship with Nobel Laureate Professor Henry Taube at Stanford University. He joined AT&T Bell Laboratories as a member of the technical staff and has been involved with the research and development of the polymeric materials (inorganic and organic) for electronic and photonic applications. He became an AT&T Bell Laboratories Fellow (the most prestigious award bestowed by Bell Labs) for his fundamental contributions to low-cost high performance plastic packaging of semiconductors. Since 1996, he is a Professor at the School of Materials Science and Engineering at the Georgia Institute of Technology. He was named a Regents’ Professor (highest rank professor) in July 2000, elected the Class of 1935 Distinguished Professor in 2004 for his outstanding and substained contributions in research, teaching and services, and named holder of the Georgia Tech Institute Endowed chair (one of the two Institute chairs) in 2005.

 

He received many awards, among those, the AT&T Bell Labs Fellow Award in 1992, the IEEE CPMT Society Outstanding Sustained Technical Contributions Award in 1995, the Georgia Tech Sigma Xi Faculty Best Research Paper Award in 1999, Best MS, PhD and Undergraduate Thesis Awards in 2002 and 2004, respectively, the University Press (London) Award of Excellence, the IEEE Third Millennium Medal in 2000, the IEEE EAB Education Award in 2001, the IEEE CPMT Society Exceptional Technical Contributions Award in 2002, elected as holder of the Charles Smthgall Institute Endowed Chair at Georgia Tech in 2005, the Georgia Tech Outstanding PhD Thesis Advisor Award , the IEEE Components, Packaging and Manufacturing Technology Field Award in 2006, the Sigma Xi’s Monie Ferst Award in 2007 and the ASM’s TEEM Award in 2008. He holds over 50 U.S. patents, numerous international patents, has published over 600 technical papers.

 

Dr. Wong is a Fellow of the IEEE and was the president of the IEEE-CPMT Society (1992 &1993). He was elected a member of the National Academy of Engineering in 2000.

Dr. Daniel Lu is the Technical Director of Product Development – Asia Pacific, Henkel Corporation in China. Prior to joining Henkel, he worked for the R&D department of Intel Corp. as a Sr. Scientist and program manager for 7 years. He also had worked for Lucent Technologies, Amoco’s Electronics Materials Division, and the Electronics Materials Group of National Starch and Chemical Company before. He has extensive experience in electronic packaging and materials and processing. He received his MS and PhD degrees on Polymer Science and Engineering from Georgia Institute of Technology in 1996 and 2000, respectively. Dr. Lu received many awards including the IEEE/CPMT Outstanding Young Engineer Award in 2004, the IEEE ECTC best poster paper in 2007, Intel’s most patent filing in 2003-2007, Intel Divisional Recognition Awards in 2002, 2003, and 2007, Intel most patent granting of the year for 2006 and 2007. Dr. Lu has published more than 50 technical papers, wrote chapters for five books, holds 53 US patents, and has more than 20 pending patent applications. He is the editor of the book “Materials for Advanced Packaging” and co-author of the book “Electronically Conductive Adhesives with Nanotechnologies”. He has been serving key roles in organizing international electronic packaging conferences and teaching professional development short courses in these conferences. Dr. Lu is a senior member of IEEE, and an associate editor of IEEE Transactions on Advanced Packaging and Journal of Nanomaterials.