Call For Papers
The 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP 2010) will be held in
ICEPT-HDP 2010 is a four-day event, featuring technical sessions, short courses/forums, exhibition, and social and networking activities. It aims to cover the latest technological developments in electronic packaging, manufacturing and packaging equipment, and provide opportunities to explore the trends of research and development, as well as business in
CONFERENCE THEMES
· Advanced Packaging & System Integration: Wafer level packaging, 3D integration, TSV (through Silicon Via), flip chip packaging, RF-ID, 3D SiP packaging solutions for MEMS, MOEMS, NEMS, automotive electronics, and optoelectronics.
· Packaging Materials & Processes: Materials and processes for traditional and advanced microelectronic systems, MEMS, solar, green and biomedical packaging.
· Packaging Design and Modeling: New packaging/assembly designs; methods/technologies/software for modeling, simulation and validation of electrical, thermal, optical and mechanical performance; multi-scale and multi-physics modeling.
· High Density Substrate & SMT: Embedded passives and active components; micro-via, high performance multi-layer substrate and PCB; hybrid integration and multi-chip module technology.
· Advanced Manufacturing Technologies and Packaging Equipment: Packaging/assembly equipment; measurement techniques; novel packaging/assembly technologies for manufacturability and yield improvement.
· Quality & Reliability: Quality monitoring and evaluation for packaging/assembly; advanced methods/technologies/tools for rapid reliability data collection/analysis, reliability modeling & life prediction;
· Emerging Technologies: Sensors, actuators, MEMS, NEMS & MOEMS; optoelectronics & LED packaging; LCD, passive & RF devices, power & HV devices; nano-devices based on nano-wires, nano-tubes and polymers, etc.
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IMPORTANT DATES
q April 6, 2010 Deadline for Submission of Abstract
q April 30, 2010 Notification of Acceptance
q July 16 , 2010 Deadline for Submission of Manuscript
SUBMISSION OF ABSTRACT
Abstracts are solicited to describe original and unpublished work. The abstract should be approx. 500 words and contains a clear statement of the background, methodology, results, conclusions, and important references of the work. All abstracts must be in English and should be submitted using the format provided in the attached word file to icept2010@xidian.edu.cn. The template for abstract submission can be downloaded at the conference website http://www.icept.org.
The abstracts must be received by April 6, 2010. Authors must include their affiliations, mailing addresses, telephone and fax numbers, and email addresses. Authors will be notified of paper acceptance by April 30, 2010. The final manuscripts for publication in the conference proceedings are due by July 16, 2010.
BEST CONFERENCE PAPERS AND BEST STUDENT PAPERS
The conference proceeding is an official IEEE publication. Best Conference and Best Student Papers will be selected and awarded at the conference.
CALL FOR SHORT COURSES
The conference program includes short courses which will be conducted by leading experts in the field. Details will be updated in the conference website and available in subsequent mailings. Proposals for short courses can be submitted to Dr. Wenhui Zhu at WH_Zhu@sg.utacgroup.com.
CALL FOR EXHIBITION/SPONSORSHIP
A tabletop exhibition featuring suppliers of materials, equipment, components and software, manufacturers, and service providers of the electronics packaging and related industries will be held during the conference. Potential exhibitors and sponsors may email icept2010@xidian.edu.cn for details.
Conference Chair: Prof. Keyun Bi
Organization Chair: Prof. Yiqi Zhuang
Technical Chair: Dr. Xuejun Fan
Conference Website: http://www.icept.org
Conference Email: icept2010@xidian.edu.cn
ABOUT LOCATION