Advanced Packaging & System Integration: BGA, CSP, flip chip; WLP, SiP, other advanced packaging and system integration technologies.
Packaging Materials & Processes: Green materials, nano-materials and other novel materials for packaging performance enhancement and cost reduction; and various new packaging/assembly processes.
Packaging Design and Modeling: New packaging/assembly designs; methodologies for modeling, simulation and validation of electrical, thermal, optical and mechanical performance of various electronics packages; multi-scale and multi-physics modeling.
High Density Substrate & SMT: Substrate with embedded passives and active components; HDI substrate, PCB, high performance multilayer substrate; and various novel assembly technologies that improve substrate density and performance.
Advanced Manufacturing Technologies and Packaging Equipment: Advanced packaging/assembly related equipment; measurement techniques. Advanced manufacturing technologies for manufacturability and yield improvement, cost reduction and service performance improvement
Quality & Reliability: Quality monitoring and evaluation; methodologies for accelerated reliability data collection and analysis, reliability modeling and life prediction; failure analysis and nondestructive diagnose.
Solid State Lighting Packaging & Integration: CoB, WLP and other advanced packaging/integration technologies; methodologies for design, manufacturing and testing of high power LED module; LED packaging/integration technologies and their applications in LCD, micro-projector, in-door lighting, street lamp, etc.
Emerging Technologies: Packaging technologies for 3D, TSV, MEMS, NEMS and MOEMS; optoelectronics packaging; nano-devices, sensors, actuators, etc.
Abstracts are solicited to describe original and unpublished work. The abstract should be approx. 500 words and contains a clear statement of the background, methodology, results, conclusions, and important references of the work. All abstracts must be in English and should be submitted using the format provided in the attached word file to email@example.com.
The template for abstract submission can be downloaded at the conference website http://www.icept.org. Selected papers will be recommended for publication in IEEE/CPMT journals.
BEST CONFERENCE PAPERS AND BEST STUDENT PAPERS
The conference proceeding is an official IEEE publication. Best Conference and Student Papers will be selected and awarded at the conference.
March 31, 2013 Deadline for Submission of Abstract
May 5, 2013 Notification of Acceptance
June 23, 2013 Deadline for Submission of Manuscript