中文版English

The 11^th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP 2010) will be held in Xi’an, China, from August 16 to 19, 2010. The ICEPT-HDP is organized by Electronic Manufacturing and Packaging Technology Society (EMPT) of Chinese Institute of Electronics, and supported by IEEE CPMT. The ICEPT-HDP 2010 will be hosted and co-organized by Xidian University.

ICEPT-HDP 2010 is a four-day event, featuring technical sessions, short courses/forums, exhibition, and social and networking activities. It aims to cover the latest technological developments in electronic packaging, manufacturing and packaging equipment, and provide opportunities to explore the trends of research and development, as well as business in China.

CONFERENCE THEMES

·          Advanced Packaging & System Integration: Wafer level packaging, 3D integration, TSV (through Silicon Via),  flip chip packaging, RF-ID, 3D SiP packaging solutions for MEMS, MOEMS, NEMS, automotive electronics, and optoelectronics.

·          Packaging Materials & Processes: Materials and processes for traditional and advanced microelectronic systems, MEMS, solar, green and biomedical packaging.

·          Packaging Design and Modeling: New packaging/assembly designs; methods/technologies/software for modeling, simulation and validation of electrical, thermal, optical and mechanical performance; multi-scale and multi-physics modeling.

·          High Density Substrate & SMT: Embedded passives and active components; micro-via, high performance multi-layer substrate and PCB; hybrid integration and multi-chip module technology.

·          Advanced Manufacturing Technologies and Packaging Equipment: Packaging/assembly equipment; measurement techniques; novel packaging/assembly technologies for manufacturability and yield improvement.    

·          Quality & Reliability: Quality monitoring and evaluation for packaging/assembly; advanced methods/technologies/tools for rapid reliability data collection/analysis, reliability modeling & life prediction;

·          Emerging Technologies: Sensors, actuators, MEMS, NEMS & MOEMS; optoelectronics & LED packaging; LCD, passive & RF devices, power & HV devices; nano-devices based on nano-wires, nano-tubes and polymers, etc.

·          Solid State Lighting (SSL) Packaging and Integration: A special session will be added at ICEPT-HDP 2010 on LED packaging, integration and reliability.

IMPORTANT DATES

q       April 6, 2010                 Deadline for Submission of Abstract

q       April 30, 2010     Notification of Acceptance

q       July 16 , 2010               Deadline for Submission of Manuscript

SUBMISSION OF ABSTRACT

Abstracts are solicited to describe original and unpublished work. The abstract should be approx. 500 words and contains a clear statement of the background, methodology, results, conclusions, and important references of the work. All abstracts must be in English and should be submitted using the format provided in the attached word file to icept2010@xidian.edu.cn. The template for abstract submission can be downloaded at the conference website http://www.icept.org.

The abstracts must be received by April 6, 2010. Authors must include their affiliations, mailing addresses, telephone and fax numbers, and email addresses. Authors will be notified of paper acceptance by April 30, 2010. The final manuscripts for publication in the conference proceedings are due by July 16, 2010.

BEST CONFERENCE PAPERS AND BEST STUDENT PAPERS 

     The conference proceeding is an official IEEE publication. Best Conference and Best Student Papers will be selected and awarded at the conference.

CALL FOR SHORT COURSES

     The conference program includes short courses which will be conducted by leading experts in the field. Details will be updated in the conference website and available in subsequent mailings. Proposals for short courses can be submitted to Dr. Wenhui Zhu at WH_Zhu@sg.utacgroup.com.

CALL FOR EXHIBITION/SPONSORSHIP 

A tabletop exhibition featuring suppliers of materials, equipment, components and software, manufacturers, and service providers of the electronics packaging and related industries will be held during the conference. Potential exhibitors and sponsors may email icept2010@xidian.edu.cn for details.

Conference Chair:             Prof. Keyun Bi

Organization Chair:          Prof. Yiqi Zhuang

Technical Chair:                          Dr. Xuejun Fan

Conference Website:          http://www.icept.org

Conference Email:             icept2010@xidian.edu.cn

ABOUT LOCATION

Xi'an, located in the central-northwest China, is one of the oldest cities in chinese history, and one of the four great ancient capitals of China. For being the eastern gate of the Silk Road and the site of the famous Terra-cotta Warriors of the Qin Dynasty, Xi'an gains reputation from all over the world. More than 3,100 years' history including over 1,100 years being the capital city of ancient dynasties endows Xian with amazing historical heritage. Xi’an is also an important base for scientific research, higher education, science and technology, and national defense and high-tech industry in China's central and western regions.