The International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP 2010) is to be held in Xi’an, China, from August 16 to 19, 2010.Until 2009, ICEPT-HDP, which is organized by Electronic Manufacturing and Packaging Technology Society(EMPT) of Chinese Institute of Electronics, has been successfully held for ten times by some leading universities such as Tsinghua University, Fudan University, Harbin Institute of Technology, Huazhong University of Science & Technology and Shanghai Jiaotong University. This conference has provided a great technical platform for international and domestic experts, scholars, and researchers from academia and industries to exchange their ideas on the development of electronic packaging. As one of the most famous international conferences on electronic packaging technology, it was greatly supported by IEEE-CPMT, IMAPS, ASME and iNEMI, and highly appreciated by China Institute of Electronics and China Association of Science.
ICEPT-HDP 2010, co-organized by Xidian University, is a 4-day event. The conference will feature short courses, conference keynotes, special forums, technical sessions and posters to cover the technological developments in all the areas of electronics packaging. You are welcomed to submit an abstract and attend the conference.
CONFERENCE THEMES
q Advanced Packaging & System Integration: BGA, CSP, flip chip; WLP, SoP, SiP; 3D packaging, PoP, TSV; micro- & nano-system packaging; and other advanced packaging and system integration technologies.
q Packaging Materials & Processes: New developments inbonding wires, solders,underfills, encapsulations, adhesives, thin films, dielectrics, substrate materials, conductive adhesives and thermal conductive materials; green electronics materials, nanomaterials and other novel materials for packaging performance enhancement and cost reduction; and various packaging/assembly processes.
q Packaging Design and Modeling:Various new packaging/assembly designs;methods/technologies/software for modeling, simulation and validation of electrical, thermal, optical and mechanical performance of various electronics packages; chip-packaging-PCB co-design; and multi-function & scale modeling, simulation, validation methods/software.
q High Density Substrate & SMT:Substrate with embedded passives and active components; micro-via, micro-joint, HDI substrate, PCB, high performance multi-layer substrate; stencil print, reflow; and other novel assembly technologies that improve substrate density and performance.
q Packaging Equipment & Advanced Manufacturing Technologies: Newpackaging/assembly equipment; packaging equipment/measurement techniques for emerging technologies; photolithography, laser processing; novel packaging/assembly technologies for manufacturability and yield improvement, cost reduction and service performance improvement; and methods/software for modeling and monitoring of process effectiveness & cost analysis.
q Quality & Reliability: Quality monitoring and evaluation for packaging/assembly; advanced methods/technologies/tools for rapid reliability data collection/analysis, reliability modeling & life prediction; reliability issues in advanced electronics packages; failure analysis,non-destructive diagnose, and yield analysis.
q Emerging Technologies:Packaging technologies for Sensors, actuators, MEMS, NEMS & MOEMS; optoelectronics & LED packaging; LCD, passive & RF devices, power & HV devices; nano-devices based on nano-wires, nano-tubes and polymers, etc.
SUBMISSION OF ABSTRACT/PAPER
Abstracts are solicited to describe original and unpublished work. The abstract should be approx. 500 words and contains a clear statement of the background, methodology, results, conclusions, and important references of the work. All abstracts must be in English and should be submitted using the format provided in the attached word file to icept2010@xidian.edu.cn.
The abstracts must be received by April6, 2010. Authors must include their affiliations, mailing addresses, telephone and fax numbers, and email addresses. Authors will be notified of paper acceptance by April30, 2010. The final manuscripts for publication in the conference proceedings are due by July 16, 2010. Selected papers will be recommended for publication in IEEE/CPMT journals.
CALL FOR EXHIBITION/SPONSORSHIP
A tabletop exhibition featuring suppliers of materials, equipment, components and software, manufacturers, and service providers of the electronics packaging and related industries will be held during the conference. Potential exhibitors and sponsors may emailicept2010@xidian.edu.cn; for details.
IMPORTANT DATES
q April6, 2010 – Deadline for Submission of Abstract
q April 30, 2010 – Notification of Acceptance
q July 16 , 2010 – Deadline for Submission of Manuscript